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Journal Articles

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
https://doi.org/10.1115/1.2957459
Published Online: July 30, 2008
..., among others, have made the multidisciplinary design and optimization process more challenging because of their time-intensive modeling and computation. In this paper, a state-of-the-art review of recent multidisciplinary design and optimization methodologies in electronics packaging is presented...
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Topics: Design, Electronic packaging, Optimization, Optimization algorithms