... 07 2009 09 08 2010 09 12 2010 09 12 2010 aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography ball bonding bonding parameters gold aluminide surface topographical...

... 24 02 2010 24 09 2010 03 12 2010 03 12 2010 chip-on-board packaging contact resistance gold lead bonding tape automated bonding thin films tin In the past two decades, liquid crystal displays (LCDs) have a big market share in the industry of flat panel display...

... of ultrasonic vibrations to the bonding interface ( 1 ). wire bonding bonding electrical signal feature extraction principal components analysis bond quality band-pass filters data acquisition electronics packaging feature extraction Hilbert transforms lead bonding neural nets principal...

... . 10.1016/j.microrel.2007.08.008 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors semiconductor device reliability temperature distribution thermal analysis thermal stress...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... diameter. Figure 10 schematically illustrates the mode of failure of the gold ball bonds with and without aging and copper ball bonds when shear tested. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear...

.... The results indicate good agreement (∼6% discrepancy) between the numerical model and the measurement. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density...

... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...

... shown in Fig. 1 and 2 does not have symmetry along the length of the joint. soldering lead bonding adhesion thermomechanical treatment stress analysis 01 June 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication...

... gallium arsenide power amplifiers radiofrequency amplifiers MESFET integrated circuits field effect analogue integrated circuits integrated circuit packaging high-temperature electronics lead bonding thermal resistance thermal conductivity integrated circuit modelling integrated circuit...

... , J. P. , and Evans , R. W. , 1964 , “ The High-Temperature Creep and Fracture of Polycrystalline Gold ,” J. Inst. Met. , 92 , pp. 409 – 412 . Takahashi , Y. , Inoue , M. , and Inoue , K. , 1999 , “ Numerical Analysis of Fine Lead Bonding Effect of Pad Thickness...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...

... PACKAGING . Manuscript received Aug. 2001; final revision, Oct. 2002. Associate Editor: B. Courtois. 01 Aug 2001 01 Oct 2002 17 09 2003 automotive electronics ball grid arrays plastic packaging lead bonding thermal conductivity thermal management (packaging) Thermal...

... scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Wafer Level Packaging Chip Scale Package Wire Interconnect Technology The function and design...

... of an electronic chip. Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the EPPD May 31, 2001. Associated Editor: E. Lorenzini. 31 May 2001 26 07 2002 thermal management (packaging) lead bonding...

... on the numerical results. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters March 13, 2001. Associate Editor: Y. C. Lee. 13 March 2001 plastic deformation hardness lead bonding...