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Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
...Sougata Hazra; Ki Wook Jung; Madhusudan Iyengar; Chris Malone; Mehdi Asheghi; Kenneth E. Goodson Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures...
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in <span class="search-highlight">Laser</span> Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in <span class="search-highlight">Laser</span> Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
https://doi.org/10.1115/1.3103932
Published Online: April 1, 2009
...Zongjie Han; Songbai Xue; Jianxin Wang; Xin Zhang; Shenglin Yu; Liang Zhang In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering system, and compared...
View Article titled, <span class="search-highlight">Laser</span> Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
Open the PDF for <span class="search-highlight">Laser</span> Soldering of Fine Pitch QFP Devices Using Lead-Free Solders in another window
Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering
Journal Articles

Improved Method of C O 2 Laser Cutting of Aluminum Nitride

Raathai Molian, Pranav Shrotriya, Pal Molian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
https://doi.org/10.1115/1.2912223
Published Online: May 8, 2008
...Raathai Molian; Pranav Shrotriya; Pal Molian The traditional “evaporation∕melt and blow” mechanism of C O 2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum...
View Article titled, Improved Method of C O 2 <span class="search-highlight">Laser</span> Cutting of Aluminum Nitride
Open the PDF for Improved Method of C O 2 <span class="search-highlight">Laser</span> Cutting of Aluminum Nitride in another window
Topics: Aluminum, Cutting, Fracture (Materials), Laser cutting, Lasers, Thermal stresses, Fracture (Process), Oxygen, Stress