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Keywords: heat flux
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
...Pablo D. Quinones; Lawrence S. Mok A cooling device using stacked centrifugal fans and circular heat sinks was designed for cooling a semiconductor chip with a heat flux near 125 W / cm 2 . In this device, heat is conducted from the chip to a copper heat distribution block and then distributed...
