...Yang Liu; Zhao Li; Min Zhou; Xianghua Zeng; Fenglian Sun Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results indicated...

...Zuozhu Yin; Fenglian Sun; Mengjiao Guo In electronic packaging, most researchers are mainly focused on the mechanical properties of Cu–Sn intermetallic compounds (IMCs) at room temperature; few studies have looked into the relationship between hardness, elastic modulus, and plasticity of IMCs...

... Young's modulus and hardness at high temperatures. It is demonstrated that these properties are a function of temperature for both β-Sn rich and eutectic phases. Loadings starting from 500 μ N up to 5000 μ N are used with 500 μ N steps and average values are presented for Young's modulus and hardness...

.... In samples subjected to thermomigration, near the cold side the Cu concentration is significantly higher compared with hot side. Extensive surface hardness testing showed an increase in hardness from the hot to cold sides, which possibly indicates that Sn grain coarsening is in the same direction. 25 09...

... and the hardness. An important assumption in the analysis of the indentation is that the indented medium is a semi-infinite plane or half space, i.e., it has an “infinite thickness.” In nanoindentation the analyzed material is often a thin film that is deposited on a substrate. If the modulus ratio is small, (soft...

... gold wire, the recrystallization temperature found using D.S.C. was 340.66°C and the dopants were identified using TOF-SIMS and hardness dependence on load was studied using nanoindentation. The nanoindentation of wirebond has confirmed a v -shaped hardness profile with minima at 166 μm along the HAZ...

...Tan Chee Wei; Abdul Razak Daud Mechanical and electrical properties of the Au-Al intermetallics layer were compared to the Cu-Al intermetallics layer. A thermal aging test was used to expedite the formation and growth of the intermetallics layer. Dynamic hardness, surface hardness...

...Yasuo Takahashi; Michinobu Inoue The purpose of the present study is to understand the interfacial deformation between pad and wire and the effect of the pad thickness, the pad hardness, and the tool shape on the interfacial deformation. The relationship between the bondability and the interfacial...