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Keywords: grinding
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
Published Online: July 8, 2004
...X. J. Xin; Z. J. Pei; Wenjie Liu Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required to manufacture high quality silicon wafers. Surface grinding is one...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
... was determined predominantly by the geometry and scratch tip sharpness of a few large and deep scratches formed during wafer thinning. Although additional polishing by dry-polishing technique after traditional mechanical coarse/fine grinding could greatly improve the average roughness of the die surface...