...Chih-Sung Chen Polymeric material has been applied in electronic product extensively, especially for packaging applications, thus thermomechanical analyses for encapsulated structure are frequently encountered. However, modulus and thermally induced strain of polymeric material are not constant...

...M. K. Abdullah; M. Z. Abdullah; M. A. Mujeebu; Horizon Gitano; Z. M. Ariff; R. Razali; K. A. Ahmad A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze...

...Cheng-Hung Huang; Wei-Lun Chang A three-dimensional inverse heat conduction problem is solved in the present study by using the conjugate gradient method (CGM) and the general-purpose commercial code CFD − ACE + to estimate the strength of the unknown heat generation for an encapsulated chip...

...Jason M. Brand; Salvatore A. Ruggero; Amip J. Shah As packaging continues to offer challenges with variable stacked die configurations of increasing complexity, traditional transfer mold encapsulation faces challenges in defining a robust process window. A major concern is the problem of “wiresweep...

...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...

...Shiang-Yu Teng; Sheng-Jye Hwang Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was neglected. A new approach considering both cure- and thermal-induced...

...T. Bar-Kohany; A. Stern Generally, microelectro mechanical systems (MOEMS) devices require encapsulation for protecting their fragile and tiny inner components in a hermetically sealed cavity. Cavity hermeticity can be critical to the device performance and plays a vital role with respect...

... on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM...

...Man-Lung Sham; Jang-Kyo Kim Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which...

... of stackable, encapsulated devices. Using a transfer molded epoxy demonstrator, a proof-of-concept is performed showing the feasibility of the stackable package approach. This is achieved by combining wafer level encapsulation and molded interconnect device technology. An electroless process for metallization...

... packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging Many simple processes for flip chip assemblies at low costs have been developed 1 2 3 4 5 . There are many options to select from for a particular application...

...X. B. Chen In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding...

... shift. Paddle shift is the deflection of the leadframe pad and die. Excessive paddle shift reduces the encapsulation protection for the components and may result in failures due to excessive wire sweep. Computer-aided analysis is one of the tools that could be used to simulate and predict the occurrence...

... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...

... of the vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...

...Ji Hyuck Yang; Kang Yong Lee The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process shows elastic and viscoelastic behaviors and to suggest the optimum design...

...L. J. Ernst; G. Q. Zhang; K. M. B. Jansen; H. J. L. Bressers For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding compounds are used for encapsulation...

..., and intermetallic thickness of both bonding systems was compared. Unencapsulated samples were subjected to a ball shear test while encapsulated samples were electrically tested. Results showed that the Cu-Al intermetallics layer is relatively harder than Au-Al. Both intermetallic thicknesses grow linearly at about...

... in LSI plastic packages with either a Cu alloy or alloy 42 leadframe. We used linear fracture mechanics to estimate the effects of the delamination length on encapsulant resin cracking. We made three main findings. (1) The Kr 85 penetration test was found to be a powerful technique...

... ratio. I.J. would like to acknowledge the support by the NSF (Grant No. CMS-0085137) and the AFOSR (Grant No. F49620-01-1-013; Dr. T. Hahn is the program monitor). Our related work included more realistic geometric models (accounting for the concave shape of the end of encapsulant...