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Keywords: electronics assembly
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
Published Online: April 1, 2009
... 11 2007 13 11 2008 01 04 2009 copper compounds electronics packaging fine-pitch technology laser beam applications nickel compounds silver compounds soldering tin compounds soldering laser lead-free solders QFP devices electronics assembly In recent years...
