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Keywords: diamond copper composite
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... by itself was found to contribute more than half of the overall thermal resistance of the cooling device. The thermal spreading resistance of the block can be reduced by about 70% if a piece of high-conductivity material, such as a diamond-copper composite, is inserted into its base. The thermal spreading...
