... aluminium chromium copper heat transfer molecular dynamics method nanoindentation nanotechnology Young's modulus 24 11 2009 17 01 2011 07 06 2011 07 06 2011 2011 American Society of Mechanical Engineers ...

...Christopher T. DeGroot; Derek Gateman; Anthony G. Straatman A numerical study on the effect of thermal contact resistance and its impact on the performance of finned aluminum foam heat sinks has been conducted. Calculations are based on the solution of the volume-averaged mass, momentum, and energy...

... in group 1: ( a ) 4 N sample and ( b ) 6 N sample 20 08 2009 14 04 2010 11 06 2010 11 06 2010 aluminium electromigration sputtering thin film circuits EM high purity Al film grain boundary diffusion AFD activation energy Thin films...

...Christopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves...

.... The smooth surface of the UBM leads to a better shear strength with only a minimum Al dissolved. Qi , G. , Fokkink Lambertus , G. J. , and Chew , K.-H. , 2002 , “ Zincating Morphology of Aluminum Bond Pad: Its Influence on Quality of Electroless Nickel Bumping ,” Thin Solid Films 0040...

... wire size is around 370 J ∕ m 2 , while an aged gold ball bond consumes about 520 J ∕ m 2 . Void nucleation and coalescence mechanism of ductile fracture takes place in the ball and stitch bonds, however, silicon particles may be the preferential void nucleation sites in bond pad aluminum metallization...

...A. Bhattacharya; R. L. Mahajan In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. (PPI)] and porosities (0.89–0.96). The results show that compared to a heated...

... in Microelectronic Packages ,” IEEE Trans. Compon., Hybrids, and Manuf. Technol. , 13 ( 2 ), pp. 383 – 389 . Zhang , J. H. , Chan , Y. C. , Alam , M. O. , and Fu , S. , 2003 , “ Contact Resistance and Adhesion Performance of ACF Connections to Aluminum Metallization ,” Microelectron. Reliab...

... experimentally and correlations for them are presented. To validate the compact model proposed in this paper, 20 aluminum pin fin heat sinks having a 101.43 mm×101.43 mm base size are tested with an inlet velocity ranging from 1 m/s to 5 m/s. In the experimental investigation, the heat sink is heated uniformly...

... bump failure. Passivation cracks also develop around the circumference of BCB passivation over aluminum pad. A model is presented for the degradation of interconnect bump with surrounding BCB passivation. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL...

... from forced convective flow between infinite parallel plates. To validate the compact model proposed in this paper, three aluminum straight fin heat sinks having a base size of 101.43 mm × 101.43 mm are tested with an inlet velocity ranging from 0.5 m/s to 2 m/s. In the experimental investigation...

...Tzer-Ming Jeng; Li-Kang Liu; Ying-Huei Hung A novel semi-empirical model with an improved single blow method for exploring the heat transfer performance of porous aluminum-foam heat sinks in a channel has been successfully developed. The influencing parameters such as the steady-state air...

... and lead-free 95.5Sn3.8Ag0.7Cu solders were used to form the bumps. No solder bridging was observed between adjacent bumps, and the solder bumps exhibited good dimensional uniformity. The solder bump to aluminum (Al) pad bond integrity was found to be excellent, as evidenced by the high stress to failure...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...

...A. Bhattacharya, Research Assistant; R. L. Mahajan, Professor In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200...

... for Bonding , AGARD Lecture Series No. 102, AGARD, Harford House, London, Ch. 7. Venables , J. D. , 1984 , “ Adhesion and durability of metal-polymer bonds ,” J. Mater. Sci. , 19 , p. 2431 2431 . Brockmann , W. , 1986 , “ Adhesion in bonded aluminum joints for aircraft construction...