... lateral conductivity. The ability to mass cure the adhesive while applying the magnetic field reduced the assembly time considerably. Placement accuracy was still found to be very critical. Shear testing of adhesive joints after thermal aging showed significance past 500 h and after temperature–humidity...

... ACF joints by maintaining low contact resistance. By contrast, high contact resistance was found in assemblies treated with higher reflow. Under humidity aging (85°C/85%RH), bumpless chips proved to be unreliable due to corrosion mechanism. Moreover, ACF had shown degradation in chemical and physical...

... pitch applications. This work deals with adhesion issues between ACA on polyimide materials. The paper presents a reliability assessment of adhesive joints using ACA on polyimide substrate that was conducted by testing samples at various aging temperature, high humidity and high pressure environments...

...Changqing Liu; Paul Conway; Dezhi Li; Michael Hendriksen This research seeks to characterize the micro-mechanical behavior of Sn-Ag-Cu solder bumps/joints generated by fine pitch flip chip assembly processes. The solder bumps and joints that were aged at either 80 °C or 150 °C for up to 440 hours...

...Steven Murray; Craig Hillman; Michael Pecht One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper...

...Qiang Xiao; Harold J. Bailey; William D. Armstrong Relationships between microstructural and mechanical aging effects in eutectic PbSn and Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared. The room temperature aged Sn3.9Ag0.6Cu alloy continually age-softened, this softening correlated...

...Tan Chee Wei; Abdul Razak Daud Mechanical and electrical properties of the Au-Al intermetallics layer were compared to the Cu-Al intermetallics layer. A thermal aging test was used to expedite the formation and growth of the intermetallics layer. Dynamic hardness, surface hardness...

... with increasing conveyor speed. As a result, the “crystallization degree” of the solder joint microstructure decreased with the increasing of cooling rate. The thickness of IMC layer increased with extension of aging time. The growth of IMC is a diffusion-controlled process, i.e., tin diffuses into copper...

...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from...

... bonded interfaces showed spontaneous delamination when aged in distilled water for 36h at 94°C. On the other hand, 3-APES and mixtures of 3-APES bonded interfaces did not show any detrimental effect of the cyclic fatigue resistance when aged in distilled water at temperatures up to 98°C. Understanding...

... of the interconnects, are found to create new failure modes due to hygromechanical swelling. Based on experimental observations, the failure mechanism is hypothesized to be cracking of intermetallics, which have weakened due to thermal aging. Pseudo 3-D finite element analyses are conducted to quantify the moisture...

... greater than under static loading, indicating that stress corrosion effects are negligible and that crack tip plasticity controls cyclic fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces. After aging at 94°C in water, these silane bonded epoxy/glass interfaces exhibited somewhat...