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Journal Articles

Development of Glass-Free Metal Electrically Conductive Thick Films

Zongrong Liu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
https://doi.org/10.1115/1.1329131
Published Online: July 13, 2000
...Zongrong Liu; D. D. L. Chung Air-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different...
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Topics: Electrical resistivity, Glass, Metals, Thick films, Adhesion, Alloys