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Keywords: IGBT module
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
Published Online: March 10, 2011
...Xiaoling Yu; Lianghua Zhang; Enming Zhou; Quanke Feng Presently, many methods are adopted to reduce the junction-to-case thermal resistance ( R jc ) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of these approaches is to enhance the heat spreading...
