... interface resistance in conducting heat to the heatsink [ 4 – 6 ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME...

... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...

... environment Reliability Thermal analysis Nowadays, application of outdoor electronics in daily life is constantly growing. Its deployment in climatically harsh environment creates a significant challenge for engineers to design reliable and durable electronic devices and systems. As a consequence...

... packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME–JSME joint biannual conference. 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC...

... received January 13, 2018; published online May 9, 2018. Assoc. Editor: Sreekant Narumanchi. 27 09 2017 13 01 2018 Harsh environment Power packaging Solder Power electronic devices are subject to continuously increasing heat dissipation levels because of growing current...

... can be very challenging. BGA Connectors Harsh environment Physics of failure Reliability 16 09 2017 13 01 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received...

... 20 03 2018 Electronic Failure analysis Harsh environment Ceramic packages are selected for microprocessors and similar components that support high-reliability electronics systems because they provide a hermetic environment that prevents the active device from being exposed...

.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...

...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...

... Electronic Failure analysis Harsh environment Physics of failure Reliability The rapidly growing application fields in mobility, i.e., electromobility and automated driving (AD), and fully connected vehicles, not only trigger the development of a new generation of electronic systems...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

... structures. For example, microelectromechanical system (MEMS) components are widely utilized in several applications: sensors/actuators, portable consumer electronics, radio frequency switches, etc. Depending on the application, MEMS are often operated in harsh environments which include drops and shocks...

.... , Arik , M. , and Tufekci , C. S. , 2014 , “ A Computational and Experimental Study on a Harsh Environment LED System for Vehicle Exterior Lighting Applications ,” IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ( ITherm ), Orlando, FL, May 27–30...

... to the CUF, such as silicon die sidewall–CUF, solder resist–CUF, and die passivation–CUF. Modern microeletronic packages have multiple materials and components such as epoxy mold compounds and stiffeners, attached to the package [ 1 – 3 ]. Dielectrics Electronic Flip chip Harsh environment...

... Coupon Silver corrosion product Seconds Thickness of corrosion product (Å) Exposure days Silver corrosion rate (Å/month) 1 Ag2S 373 363 30 363 2 Ag2S 240 233 30 233 Figures 21 – 23 discuss about the implications of harsh environment and elevated temperature-relative...

... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...

... 2016 14 08 2016 Harsh environment Reliability In microelectronics, there are many interfaces that come together to create a product. One such interface is found between flexible polymer films and rigid substrates. Whenever two materials are structurally bonded together, a potential...

... at High Strain Rates ,” ASME J. Electron. Packag. , 137 ( 1 ), p. 011010 . 10.1115/1.4028641 [4] Lall , P. , Kothari , N. , and Glover , J. , 2015 , “ Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments ,” ASME Paper...

... between the contact surfaces. Thus, a new thermal connector is needed to satisfy these needs [ 1 ]. Harsh environment Printed cards card Thermal analysis The electrical functionality of an avionics chassis is limited due to heat dissipation limits. The limits arise due to the fact...

... than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments. Failure analysis Harsh environment Physics of failure Reliability During their life-cycle...