... Phenomena in Electronic Systems ( ITherm ), Orlando, FL, May 30–June 2, p. 400. 10.1109/ITHERM.2017.7992502 [55] Saums , D. L. , and Jensen , T. , 2017 , “ Testing, Selecting, and Applying Metallic Thermal Interface Materials for Harsh Environment Applications ,” International Exhibition...

... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...

... environment Reliability Thermal analysis Nowadays, application of outdoor electronics in daily life is constantly growing. Its deployment in climatically harsh environment creates a significant challenge for engineers to design reliable and durable electronic devices and systems. As a consequence...

... would also like to acknowledge InterPACK 2017 General Conference Chair Dr. Mehdi Asheghi and JEP Editor Professor Y. C. Lee for their support and cooperation. 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors...

... ( TRANSDUCERS'05 ), Seoul, South Korea, June 5–9, pp. 1350 – 1353 . 10.1109/SENSOR.2005.1497331 [13] Soto , P. R. , Quintero , P. O. , Mulero , M. , and Ibitayo , D. , 2015 , “Microstructural Stability of Au–Sn SLID Joints for Harsh Environments,” ASME Paper No. IPACK2015-48323. 10.1115...

..., extreme environmental conditions with high junction temperatures and harsh road conditions. Managing and optimizing against these goals can be very challenging. BGA Connectors Harsh environment Physics of failure Reliability 16 09 2017 13 01 2018 Contributed...

... 20 03 2018 Electronic Failure analysis Harsh environment Ceramic packages are selected for microprocessors and similar components that support high-reliability electronics systems because they provide a hermetic environment that prevents the active device from being exposed...

.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...

...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...

... Electronic Failure analysis Harsh environment Physics of failure Reliability The rapidly growing application fields in mobility, i.e., electromobility and automated driving (AD), and fully connected vehicles, not only trigger the development of a new generation of electronic systems...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

... structures. For example, microelectromechanical system (MEMS) components are widely utilized in several applications: sensors/actuators, portable consumer electronics, radio frequency switches, etc. Depending on the application, MEMS are often operated in harsh environments which include drops and shocks...

... June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 28 03 2017 Flexible circuits FR-4 Harsh environment Reliability Thermal analysis With a quadruple increase of optical enhancement in late 1990s creating new application opportunities, light emitting diodes (LEDs...

... ACKAGING . Manuscript received December 16, 2016; final manuscript received March 24, 2017; published online April 24, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 24 03 2017 Electronic Failure analysis Harsh environment Physics of failure Reliability Thermal analysis...

... such as epoxy mold compounds and stiffeners, attached to the package [ 1 – 3 ]. Dielectrics Electronic Flip chip Harsh environment Polyimide Reliability Underfill 27 12 2016 24 03 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...

... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...

..., 2016; published online September 2, 2016. Assoc. Editor: Satish Chaparala. 03 03 2016 14 08 2016 Harsh environment Reliability In microelectronics, there are many interfaces that come together to create a product. One such interface is found between flexible polymer films...

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 26, 2015; final manuscript received January 6, 2016; published online March 10, 2016. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 06 01 2016 Composite materials COTS FR-4 Harsh environment MEMS...

... between the contact surfaces. Thus, a new thermal connector is needed to satisfy these needs [ 1 ]. Harsh environment Printed cards card Thermal analysis The electrical functionality of an avionics chassis is limited due to heat dissipation limits. The limits arise due to the fact...

... than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments. Failure analysis Harsh environment Physics of failure Reliability During their life-cycle...