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Keywords: Finite Element Analysis (FEA)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
Published Online: September 13, 2021
... modulus. power module insulated metal substrate (IMS) reliability test finite element analysis (FEA) Ministry of Science and Technology, Taiwan 10.13039/501100004663 MOST 109-2218-E-007-007 Table 7 Material properties for presented power modulus Material properties...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
Published Online: September 1, 2015
... impact and the dynamics of secondary impact. Model predictions are compared with test results. Details of the test methodology and simulations guidelines are provided. Detailed finite element analysis (FEA) is conducted and validated against the experimental tests and compared to the simplified...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021012.
Published Online: April 21, 2009
... ) swelling coefficient (β) hygrostress input and output (I/O) liquid crystal display (LCD) integrated circuit (IC) finite element analysis (FEA) Anisotropic conductive film (ACF) has been introduced as a promising flip chip interconnection material, due to its potential in achieving high density...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
...J.-B. Han Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack...
