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Keywords: FE simulation
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
Published Online: October 6, 2021
... board 21 01 2021 17 06 2021 06 10 2021 PHM canary structures solder joint reliability FE simulation thermomechanical warpage Electronics subjected to thermal cycling loads are prone to solder joint fatigue as a prevalent failure mechanism. Unavoidable differences...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
Published Online: May 8, 2008
.... 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation modal test drop test Handheld electronic products such as personal digital assistant and mobile...