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Keywords: Die
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
...J.-B. Han Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack...
