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Keywords: Design of Experiment (DOE)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
... of experiments Ball Grid Array (BGA) Crack Die Finite Element Analysis (FEA) Flip-Chip Fracture Mechanics Design Methodology Design of Experiment (DOE) Time to market has become a critical factor for electronics industry, which determines how much profit a company can make and how well...
