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Keywords: Design Methodology
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Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
https://doi.org/10.1115/1.4033109
Published Online: April 19, 2016
... March 18, 2016; published online April 19, 2016. Assoc. Editor: Mehmet Arik. 19 02 2016 18 03 2016 Algorithms Coupled codes Design methodology Electrical design Heat transfer PWB PWB Design Thermal systems Numerical Integration methods Metal wiring in PCBs carries...
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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation
Journal Articles

Flip-Chip BGA Design to Avert Die Cracking

J.-B. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
https://doi.org/10.1115/1.1329130
Published Online: October 29, 1999
... of experiments Ball Grid Array (BGA) Crack Die Finite Element Analysis (FEA) Flip-Chip Fracture Mechanics Design Methodology Design of Experiment (DOE) Time to market has become a critical factor for electronics industry, which determines how much profit a company can make and how well...
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Topics: Ball-Grid-Array packaging, Design, Finite element analysis, Flip-chip, Fracture (Materials), Fracture (Process), Fracture mechanics, Cracking (Materials)