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Journal Articles

Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

Aleksander Sesek, Olga Chambers, Janez Trontelj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021005.
Paper No: EP-18-1040
https://doi.org/10.1115/1.4042804
Published Online: March 4, 2019
View Article titled, Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
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Topics: Image processing, Image segmentation, X-rays, Shapes, Soldering, Edge detection
Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
https://doi.org/10.1115/1.4036384
Published Online: June 12, 2017
View Article titled, Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
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Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Jin Yang, Lizheng Zhang, I. Charles Ume, Camil Ghiu, George White
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
https://doi.org/10.1115/1.4001832
Published Online: June 23, 2010
View Article titled, Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System
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Topics: Cycles, Inspection, Lasers, Reliability, Solder joints, Ultrasound, X-rays, Fracture (Materials)
Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
View Article titled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
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Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection
Journal Articles

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography

Hiroyuki Tsuritani, Toshihiko Sayama, Kentaro Uesugi, Takeshi Takayanagi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 434–439.
https://doi.org/10.1115/1.2804093
Published Online: May 2, 2007
View Article titled, Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
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Topics: Cycles, Nondestructive evaluation, Solders, X-rays, Synchrotron radiation, Flip-chip devices, Tin, Reliability, Computerized tomography
Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
https://doi.org/10.1115/1.2229223
Published Online: November 29, 2005
View Article titled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays
Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
View Article titled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
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Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films
Journal Articles

Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)

J. Zhang, C. Q. Cui, T. B. Lim, E. T. Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 291–296.
https://doi.org/10.1115/1.2793855
Published Online: December 1, 1999
View Article titled, Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB)
Open the PDF for Surface Graft Copolymerization Enhanced Lamination of Poly(tetrafluoroethylene) Film to Copper and Epoxy-Based Print Circuit Board (PCB) in another window
Topics: Copper, Epoxy resins, Lamination, Printed circuit boards, Adhesion, Resins, Plasmas (Ionized gases), Atomic force microscopy, Polymerization, Temperature
Journal Articles

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

S. Han, K. K. Wang, D. L. Crouthamel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 247–254.
https://doi.org/10.1115/1.2792245
Published Online: December 1, 1997
View Article titled, Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation
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Topics: Semiconductors (Materials), Wire, Cavities, Epoxy adhesives, Epoxy resins, Manufacturing, Materials properties, Molding, Shapes, Temperature
Journal Articles

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

D. T. Read, G. K. Lucey, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 178–185.
https://doi.org/10.1115/1.2905384
Published Online: June 1, 1991
View Article titled, Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints
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Topics: Finite element analysis, Mesh generation, Solder joints, Surface mount technology, X-rays, Computer software, Failure, Inspection, Machinery, Modeling
Journal Articles

Indentation Method to Measure Plating Ductility

P. A. Engel, D. L. Questad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 272–277.
https://doi.org/10.1115/1.2904378
Published Online: September 1, 1990
View Article titled, Indentation Method to Measure Plating Ductility
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Topics: Ductility, Plating, Fracture (Materials), Displacement, Durability, Electron microscopy, X-rays