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Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031010.
Paper No: EP-21-1079
https://doi.org/10.1115/1.4051754
Published Online: September 15, 2021
View Article titled, A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
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Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)
Includes: Supplementary data
Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2020, 142(4): 040801.
Paper No: EP-19-1126
https://doi.org/10.1115/1.4047472
Published Online: June 29, 2020
View Article titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Article titled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
https://doi.org/10.1115/1.4026626
Published Online: February 18, 2014
View Article titled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption
Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
https://doi.org/10.1115/1.4001746
Published Online: June 11, 2010
View Article titled, Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics
Journal Articles

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

Yi-Shao Lai, Ying-Ta Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
https://doi.org/10.1115/1.2957325
Published Online: November 13, 2008
View Article titled, Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
Open the PDF for Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing in another window
Topics: Electrodiffusion, Flip-chip, Reliability, Solder joints, Tin, Weight (Mass)
Journal Articles

Development of G-Helix Structure as Off-Chip Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
https://doi.org/10.1115/1.1756148
Published Online: July 8, 2004
View Article titled, Development of G-Helix Structure as Off-Chip Interconnect
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Topics: Design, Displacement, Geometry, Manufacturing, Optimization, Packaging, Reliability, Solders, Stress, Thermomechanics
Journal Articles

Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

A. Tava´rez, J. E. Gonza´lez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
https://doi.org/10.1115/1.1569955
Published Online: September 17, 2003
View Article titled, Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens
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Topics: Ovens, Solders, Temperature, Weight (Mass), Modeling, Heat transfer, Heating, Cooling, Temperature profiles, Melting
Journal Articles

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, Fellow ASME, C. L. Jiaa, S. J. Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 379–384.
https://doi.org/10.1115/1.1510862
Published Online: December 12, 2002
View Article titled, Corrosion Analysis of a Fiber-Optic Transceiver Housing
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Topics: Corrosion, Fibers, Weight (Mass)
Journal Articles

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

H. Fre´mont, J. Y. Dele´tage, A. Pintus, Y. Danto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
https://doi.org/10.1115/1.1326436
Published Online: January 1, 2000
View Article titled, Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages
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Topics: Diffusion (Physics), Molding, Resins, Water, Polymers, Diffusion processes, Weight (Mass), Ceramics, Finite element analysis, Geometry
Journal Articles

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
https://doi.org/10.1115/1.483128
Published Online: October 20, 1999
View Article titled, On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications
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Topics: Adhesion, Atomic force microscopy, Coatings, Polymers, Reliability, Thermal stability, Thin films, Fracture (Process), Fracture (Materials), Silicon
Journal Articles

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

M. Uschitsky, E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
https://doi.org/10.1115/1.1325009
Published Online: September 2, 1998
View Article titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Particles
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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Fillers (Materials), Mechanical properties, Molding, Particulate matter, Sorption, Indium compounds, Stress
Journal Articles

Avionics Passive Cooling With Microencapsulated Phase Change Materials

A. J. Fossett, M. T. Maguire, A. A. Kudirka, F. E. Mills, D. A. Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 238–242.
https://doi.org/10.1115/1.2792628
Published Online: September 1, 1998
View Article titled, Avionics Passive Cooling With Microencapsulated Phase Change Materials
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Topics: Avionics, Cooling, Phase change materials, Aircraft, Aluminum plate, Design, Heat sinks, Missiles, Weight (Mass)
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
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Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 178–184.
https://doi.org/10.1115/1.2792089
Published Online: September 1, 1995
View Article titled, A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
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Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

M. B. Bowers, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 298–305.
https://doi.org/10.1115/1.2905701
Published Online: December 1, 1994
View Article titled, Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints
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Topics: Computer cooling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Geometry, Compressibility, Energy dissipation, Heat, Boiling