1-4 of 4
Wall thickness
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
https://doi.org/10.1115/1.4039790
Published Online: May 10, 2018
View Article titled, Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
Open the PDF for Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach in another window
Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness
Journal Articles

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

X. L. Xie, W. Q. Tao, Y. L. He
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
https://doi.org/10.1115/1.2753887
Published Online: December 13, 2006
View Article titled, Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
Open the PDF for Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink in another window
Topics: Cooling, Heat flux, Heat sinks, Heat transfer, Pressure drop, Temperature, Thermal resistance, Turbulence, Wall thickness, Water
Journal Articles

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien-Yu Tom Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 589–596.
https://doi.org/10.1115/1.1604804
Published Online: December 15, 2003
View Article titled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance
Open the PDF for Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance in another window
Topics: Gallium arsenide, Metals, Temperature, Thermal conductivity, Wall thickness, Thermal resistance
Journal Articles

Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source

Yi-Hsiang Huang, Suresh K. Aggarwal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 301–306.
https://doi.org/10.1115/1.2792109
Published Online: December 1, 1995
View Article titled, Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source
Open the PDF for Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source in another window
Topics: Heat, Heat conduction, Natural convection, Heat transfer, Thermal conductivity, Wall thickness, Rayleigh number, Algorithms, Boundary-value problems, Cavities