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Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique

Sadegh M. Sadeghipour, Mehdi Asheghi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 125–129.
https://doi.org/10.1115/1.2165213
Published Online: October 11, 2005
View Article titled, Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique
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Topics: Thermal characterization, Thermal conductivity, Temperature, Manufacturing
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Article titled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
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Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Warpage of Plastic IC Packages as a Function of Processing Conditions

Dickson T. S. Yeung, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 268–272.
https://doi.org/10.1115/1.1349421
Published Online: December 22, 1999
View Article titled, Warpage of Plastic IC Packages as a Function of Processing Conditions
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Topics: Molding, Warping, Finite element analysis, Temperature, Shear modulus, Thermal expansion, Glass transition, Thermal characterization
Journal Articles

An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

G. G. Stefani, N. S. Goel, D. B. Jenks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 366–372.
https://doi.org/10.1115/1.2909345
Published Online: December 1, 1993
View Article titled, An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards
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Topics: Printed circuit boards, Thermal characterization, Modeling, Computers, Finite element analysis, Microelectronic devices, Plates (structures), Surface mount technology, Thermal conductivity
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Article titled, Optimization of Extruded Type External Heat Sink for Multichip Module
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Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry

J. W. M. Spicer, M. G. Bevan, W. D. Kerns, H. S. Feldmesser
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 101–105.
https://doi.org/10.1115/1.2909287
Published Online: March 1, 1993
View Article titled, Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry
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Topics: Adhesives, Electronics, Heat sinks, Radiation measurement, Space vehicles, Thermal characterization, Epoxy adhesives, Epoxy resins, Delamination, Fracture (Materials)
Journal Articles

Stress Analysis and Thermal Characterization of a High Pin Count PQFP

A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 211–220.
https://doi.org/10.1115/1.2906420
Published Online: June 1, 1992
View Article titled, Stress Analysis and Thermal Characterization of a High Pin Count PQFP
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Topics: Stress analysis (Engineering), Thermal characterization, Molding, Stress, Junctions, Cooling, Finite element analysis, Finite element model, Flat heat pipes, Simulation
Journal Articles

Thermal-Fluid Interactions of Neighboring Components on Air-Cooled Circuit Boards

V. P. Manno, K. Azar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 374–381.
https://doi.org/10.1115/1.2905423
Published Online: December 1, 1991
View Article titled, Thermal-Fluid Interactions of Neighboring Components on Air-Cooled Circuit Boards
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Topics: Printed circuit boards, Thermofluids, Fluid dynamics, Optimization, Experimental characterization, Flow (Dynamics), Heat transfer, Thermal characterization, Unsteady flow
Journal Articles

Thermal Analysis of Surface Mounted Leadless Chip Carriers

W. T. Cooley, A. Razani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 156–163.
https://doi.org/10.1115/1.2905381
Published Online: June 1, 1991
View Article titled, Thermal Analysis of Surface Mounted Leadless Chip Carriers
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Topics: Thermal analysis, Design, Heat transfer, Thermal characterization, Computers, Finite element analysis, Geometry, Heat transfer coefficients, Junctions, Microelectronic devices