1-20 of 25
Storage
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Accepted Manuscript
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: July 20, 2024
View Article titled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
Open the PDF for Transient Liquid Phase Bond Acceleration Using Copper Nanowires in another window
Topics: Copper, Nanowires, Transients (Dynamics), Bonding, Solders, Intermetallic compounds, Temperature, Acoustic microscopy, Electroforming, Electronics
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
Open the PDF for Special Issue on InterPACK2022 in another window
Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
https://doi.org/10.1115/1.4055840
Published Online: October 22, 2022
View Article titled, Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
Open the PDF for Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer in another window
Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
Open the PDF for Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling in another window
Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article titled, Special Issue on InterPACK2020
Open the PDF for Special Issue on InterPACK2020 in another window
Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Article titled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
Open the PDF for Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation in another window
Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
https://doi.org/10.1115/1.4052669
Published Online: November 5, 2021
View Article titled, Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
Open the PDF for Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages in another window
Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities
Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Ronald J. Warzoha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2021, 143(2): 020301.
Paper No: EP-21-1004
https://doi.org/10.1115/1.4050407
Published Online: March 19, 2021
View Article titled, Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
Open the PDF for Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging in another window
Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Article titled, Special Issue on InterPACK 2019 – Part 1
Open the PDF for Special Issue on InterPACK 2019 – Part 1 in another window
Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011009.
Paper No: EP-18-1065
https://doi.org/10.1115/1.4047475
Published Online: June 26, 2020
View Article titled, Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound
Open the PDF for Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound in another window
Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041104.
Paper No: EP-20-1003
https://doi.org/10.1115/1.4047392
Published Online: June 23, 2020
View Article titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C in another window
Topics: Elastic moduli, Mechanical properties, Stress, Temperature, Tensile strength, Storage, Solders
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Article titled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
Open the PDF for Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers in another window
Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Article titled, Special Issue on InterPACK 2018
Open the PDF for Special Issue on InterPACK 2018 in another window
Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031002.
https://doi.org/10.1115/1.4006927
Published Online: July 18, 2012
View Article titled, Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Open the PDF for Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices in another window
Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing
Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
View Article titled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
Open the PDF for Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test in another window
Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
View Article titled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
Open the PDF for A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology in another window
Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 8–13.
https://doi.org/10.1115/1.1646420
Published Online: April 30, 2004
View Article titled, A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit
Open the PDF for A Hybrid Thermal Energy Storage Device, Part 2: Thermal Performance Figures of Merit in another window
Topics: Design, Heat, Metals, Storage, Thermal energy storage, Temperature
Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 97–105.
https://doi.org/10.1115/1.1459471
Published Online: May 2, 2002
View Article titled, Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
Open the PDF for Mechanical Modeling and Characterization of the Curing Process of Underfill Materials in another window
Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation
Journal Articles

Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method

T. Tanaka, H. Matsushima, A. Ueki, T. Atarashi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 73–77.
https://doi.org/10.1115/1.2792204
Published Online: March 1, 1997
View Article titled, Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method
Open the PDF for Numerical Simulation of Impingement Air Cooling From LSI Packages With Large Plate Fins by the Penalty Finite Element Method in another window
Topics: Computer simulation, Cooling, Finite element methods, Fins, Gradient methods, Algebra, Computers, Flow (Dynamics), Flow visualization, Industrial research
Journal Articles

Reliability of Postmolded IC Packages

L. T. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 346–355.
https://doi.org/10.1115/1.2909343
Published Online: December 1, 1993
View Article titled, Reliability of Postmolded IC Packages
Open the PDF for Reliability of Postmolded IC Packages in another window
Topics: Reliability, Molding, Stress, Adhesion, Water, Corrosion, Metals, Corners (Structural elements), Cracking (Materials), Damage