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Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
View Article titled, Characterization of a Rack-Level Thermosyphon-Based Cooling System
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Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature
Journal Articles

Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

R. Khalid, E. Youssef, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021005.
Paper No: EP-23-1016
https://doi.org/10.1115/1.4063252
Published Online: November 10, 2023
View Article titled, Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
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Topics: Flow (Dynamics), Heat exchangers, Refrigerants, Temperature, Heat, Cooling, Fluids, Pressure
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
https://doi.org/10.1115/1.4039706
Published Online: May 9, 2018
View Article titled, Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a
Open the PDF for Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a in another window
Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
View Article titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Article titled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
https://doi.org/10.1115/1.4027325
Published Online: April 29, 2014
View Article titled, Thermal Management of Time-Varying High Heat Flux Electronic Devices
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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling
Journal Articles

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Sarah Kim, Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031009.
https://doi.org/10.1115/1.4007111
Published Online: July 23, 2012
View Article titled, Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
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Topics: Absorption, Fluids, Heat pumps, Refrigerants, Refrigeration, Temperature, Pressure, Cooling, Heat
Journal Articles

Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a

Eduardo Martínez-Galván, Juan Carlos Ramos, Raúl Antón, Rahmatollah Khodabandeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011002.
https://doi.org/10.1115/1.4001857
Published Online: March 3, 2011
View Article titled, Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a
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Topics: Cooling, Film thickness, Heat flux, Heat transfer, Sprays, Refrigerants, Critical heat flux, Temperature, Boiling
Journal Articles

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
https://doi.org/10.1115/1.3103940
Published Online: March 27, 2009
View Article titled, Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System
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Topics: Heating, Plates (structures), Refrigerants, Stress, Cooling, Vapors, Superheating, Two-phase flow, Pressure drop, Pressure
Journal Articles

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
https://doi.org/10.1115/1.2993148
Published Online: November 13, 2008
View Article titled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
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Topics: Compressors, Condensers (steam plant), Cooling, Design, Microchannels, Refrigerants, Refrigeration, Vapors, Compression, Microelectronic devices
Journal Articles

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Robert Wadell, Yogendra K. Joshi, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
https://doi.org/10.1115/1.2753919
Published Online: March 28, 2007
View Article titled, Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors
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Topics: Flow (Dynamics), Heat, Heat flux, Heat transfer, Refrigeration, Temperature, Pressure drop, Refrigerants, Microchannels
Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 475–479.
https://doi.org/10.1115/1.1615796
Published Online: December 15, 2003
View Article titled, A Vapotron Effect Application for Electronic Equipment Cooling
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Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature
Journal Articles

An Integral Heat Sink for Cooling Microelectronic Components

S. H. Bhavnani, C.-P. Tsai, R. C. Jaeger, D. L. Eison
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 284–291.
https://doi.org/10.1115/1.2909330
Published Online: September 1, 1993
View Article titled, An Integral Heat Sink for Cooling Microelectronic Components
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Topics: Cooling, Heat sinks, Boiling, Heat, Silicon, Cavities, Atmospheric pressure, Etching, Flux (Metallurgy), Heat transfer