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Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031015.
Paper No: EP-13-1050
https://doi.org/10.1115/1.4028013
Published Online: July 24, 2014
View Article titled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature
Journal Articles

An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

Lung-Tai Chen, Wood-Hi Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
https://doi.org/10.1115/1.3144156
Published Online: July 31, 2009
View Article titled, An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer
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Topics: Photoresists, Pressure sensors, Packaging, Membranes, Finite element model
Journal Articles

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

David A. Dillard, Alok Mallick, Donatus C. Ohanehi, Jang-Horng Yu, Didier R. Lefebvre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031006.
https://doi.org/10.1115/1.2957326
Published Online: July 30, 2008
View Article titled, A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels
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Topics: Cylinders, Elastomers, High pressure (Physics), Poisson ratio, Pressure, Casting, Pressure sensors, Deformation, Stress
Journal Articles

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
https://doi.org/10.1115/1.1615249
Published Online: December 15, 2003
View Article titled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors
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Topics: Bonding, Diaphragms (Mechanical devices), Diaphragms (Structural), Finite element analysis, Microelectromechanical systems, Pressure, Pressure sensors, Silicon, Stress, Surface tension
Journal Articles

Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Amir Javidinejad, Shiv P. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 79–82.
https://doi.org/10.1115/1.1322563
Published Online: May 26, 2000
View Article titled, Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites
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Topics: Composite materials, Pressure, Pressure sensors, Sensors, Temperature sensors, Carbon fibers, Microelectromechanical systems, Reliability, Cycles