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Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
https://doi.org/10.1115/1.4051752
Published Online: August 9, 2021
View Article titled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption
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Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability
Journal Articles

Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow

Yuejin Wang, Guozhen Liu, Shiqiang Lu, Bin Guo, Hongye Zhang, Fuchun Xu, Xiaohong Chen, Duanjun Cai, Junyong Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031103.
Paper No: EP-19-1121
https://doi.org/10.1115/1.4046765
Published Online: April 17, 2020
View Article titled, Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow
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Topics: Boron, Gas flow, Magnesium (Metal), Nitrogen, Thermal conductivity, Optoelectronic devices
Journal Articles

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
https://doi.org/10.1115/1.4004218
Published Online: June 23, 2011
View Article titled, Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel
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Topics: Bronze, Gas flow, Heat flux, Heat transfer, Microchannels, Nitrogen, Slip flow, Temperature, Thermal conductivity, Silicon nitride ceramics
Journal Articles

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

Hua Ye, Harry Efstathiadis, Pradeep Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
https://doi.org/10.1115/1.2229226
Published Online: August 15, 2005
View Article titled, Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
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Topics: Cooling, Heat, MOSFET transistors, Nitrogen, Simulation, Temperature, Critical heat flux, Junctions, Energy dissipation, Boiling
Journal Articles

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Y. P. Wu, P. L. Tu, Yan C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 284–289.
https://doi.org/10.1115/1.1371782
Published Online: July 7, 1999
View Article titled, The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
Open the PDF for The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies in another window
Topics: Fatigue life, Reliability, Solder joints, Solders, Thermal shock, Ball-Grid-Array packaging, Vibration, Ceramics, Nitrogen, Cycles
Journal Articles

Uniform Channel Micro Heat Exchangers

X. Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 89–94.
https://doi.org/10.1115/1.2792225
Published Online: June 1, 1997
View Article titled, Uniform Channel Micro Heat Exchangers
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Topics: Heat exchangers, Dimensions, Heat, Thermal resistance, Flow (Dynamics), Nitrogen, Performance characterization, Semiconductor wafers, Temperature
Journal Articles

Micro Heat Exchangers Consisting of Pin Arrays

Xiaoqing Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 51–57.
https://doi.org/10.1115/1.2792200
Published Online: March 1, 1997
View Article titled, Micro Heat Exchangers Consisting of Pin Arrays
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Topics: Heat exchangers, Heat, Computer simulation, Coolants, Flow (Dynamics), Geometry, High temperature superconductors, Multi-chip modules, Nitrogen, Semiconductor wafers
Journal Articles

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 317–322.
https://doi.org/10.1115/1.2792111
Published Online: December 1, 1995
View Article titled, Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
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Topics: Heat transfer, Nitrogen, Ovens, Reflow soldering, Simulation, Buoyancy, Computer simulation, Cooling, Fluctuations (Physics), Heating
Journal Articles

Quantitative Solder Wetting Measurement for DCA Assembly

Cynthia M. Melton, Carl J. Raleigh, Susan M. Yarling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1992, 114(4): 476–479.
https://doi.org/10.1115/1.2905485
Published Online: December 1, 1992
View Article titled, Quantitative Solder Wetting Measurement for DCA Assembly
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Topics: Manufacturing, Solders, Wetting, Alloys, Experimental design, Nitrogen
Journal Articles

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 109–114.
https://doi.org/10.1115/1.2905375
Published Online: June 1, 1991
View Article titled, Superplastic Creep of Eutectic Tin-Lead Solder Joints
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Topics: Creep, Solder joints, Superplasticity, Stress, Cooling, Dislocations, Grain boundaries, Nitrogen, Recrystallization, Steady state