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Journal Articles

HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications

Dhanesh Thomas, Mailadil T. Sebastian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031002.
Paper No: EP-12-1085
https://doi.org/10.1115/1.4027089
Published Online: May 5, 2014
View Article titled, HDPE Matrix Composites Filled With Ca 4 La 6 (SiO 4 ) 4 (PO 4 ) 2 O 2 for Microwave Substrate Applications
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Topics: Composite materials, Fillers (Materials), Microwaves
Journal Articles

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020901.
https://doi.org/10.1115/1.4005909
Published Online: June 11, 2012
View Article titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
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Topics: Bonding, Carbon nanotubes, Diffusion bonding (Metals), Steady state, Test facilities, Testing, Pressure, Thermal resistance, Nanotubes, Solders
Journal Articles

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Wei Han, Marc Rensing, Peter O’Brien, Frank H. Peters
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
https://doi.org/10.1115/1.4005292
Published Online: December 9, 2011
View Article titled, Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
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Topics: Lasers, Manufacturing, Microwaves, Optimization, Packaging, Reflection, Resonance, Strip transmission lines, Simulation results, Simulation
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal, Z. Fathi, I. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 302–307.
https://doi.org/10.1115/1.1571077
Published Online: June 10, 2003
View Article titled, Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
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Topics: Convection, Delamination, Fillers (Materials), Flip-chip, Microwaves, Ovens, Particulate matter
Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 294–301.
https://doi.org/10.1115/1.1571076
Published Online: June 10, 2003
View Article titled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
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Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging
Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages
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Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Finite Element Modeling for Optimizing Hermetic Package Reliability

J. H. Lau, L. B. Lian-Mueller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 255–260.
https://doi.org/10.1115/1.3226544
Published Online: December 1, 1989
View Article titled, Finite Element Modeling for Optimizing Hermetic Package Reliability
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Topics: Finite element analysis, Modeling, Reliability, Design, Microwaves, Construction, Finite element methods, Finite element model, Leakage, Thermal stresses