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Journal Articles

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
https://doi.org/10.1115/1.1634590
Published Online: December 15, 2003
View Article titled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
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Topics: Engineering simulation, Microelectromechanical systems, Microelectronic devices, Optimization, Thermal management, Computer simulation, Failure analysis, Micromechanical devices, Packaging
Journal Articles

Foreword

Marta Rencz ,, Guest Editor, Clemens Lasance ,, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 321–322.
https://doi.org/10.1115/1.1389845
Published Online: December 1, 2001
View Article titled, Foreword
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Topics: Integrated circuit packaging, Integrated circuits, Micromechanical devices, Modeling, Packaging, Thermal management, Workshops (Work spaces)
Journal Articles

Adhesion and Reliability of Polymer/Inorganic Interfaces

S.-Y. Kook, J. M. Snodgrass, A. Kirtikar, R. H. Dauskardt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 328–335.
https://doi.org/10.1115/1.2792642
Published Online: December 1, 1998
View Article titled, Adhesion and Reliability of Polymer/Inorganic Interfaces
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics