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Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Journal Articles

A Novel Low Cost Package for Radio Frequency Applications

Sandeep Chaturvedi, Shiban K. Koul
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2013, 135(2): 024501.
Paper No: EP-11-1096
https://doi.org/10.1115/1.4023041
Published Online: March 28, 2013
View Article titled, A Novel Low Cost Package for Radio Frequency Applications
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Topics: Design, Laminates, Manufacturing, Simulation, Strip transmission lines, Strips
Journal Articles

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Shaochen Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031001.
https://doi.org/10.1115/1.4004656
Published Online: September 14, 2011
View Article titled, Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
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Topics: Finite element model, Reliability, Silicon, Stress, Temperature, Thermomechanics, Transients (Dynamics), Warping, Laminates, Deformation
Journal Articles

Joint Level Test Methods for Solder Pad Cratering Investigations

Brian D. Roggeman, Venkatesh Raghavan, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031007.
https://doi.org/10.1115/1.4004182
Published Online: September 14, 2011
View Article titled, Joint Level Test Methods for Solder Pad Cratering Investigations
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Topics: Laminates, Resins, Shear (Mechanics), Solders, Testing, Stress, Failure, Temperature
Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
https://doi.org/10.1115/1.4001746
Published Online: June 11, 2010
View Article titled, Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics
Journal Articles

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
https://doi.org/10.1115/1.2993126
Published Online: November 14, 2008
View Article titled, Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
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Topics: Copper, Flow (Dynamics), Heat, Heat conduction, Insulation, Laminates, Modeling, Printed circuit boards, Resins, Temperature
Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
View Article titled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards
Journal Articles

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Jun Xu, Richard A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 353–356.
https://doi.org/10.1115/1.1997162
Published Online: October 31, 2004
View Article titled, In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates
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Topics: Diamonds, Laminates, Thermal conductivity, Porosity
Journal Articles

Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

J. Cepeda-Rizo, Hsien-Yang Yeh, N. Teneketges
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 178–184.
https://doi.org/10.1115/1.1898339
Published Online: September 30, 2004
View Article titled, Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects
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Topics: Laminates, Printed circuit boards, Warping, Approximation, Sensors, Pressure, Displacement, Stress
Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
https://doi.org/10.1115/1.1535446
Published Online: March 14, 2003
View Article titled, Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics
Journal Articles

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

Keith B. Bowman, David H. Mollenhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
https://doi.org/10.1115/1.1497627
Published Online: December 12, 2002
View Article titled, Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry
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Topics: Interferometry, Polymers, Residual stresses, Stress, Laminates, Temperature, Displacement, Stress concentration
Journal Articles

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

Xiaoling He, Robert E. Fulton, Fellow ASME Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 77–84.
https://doi.org/10.1115/1.1457454
Published Online: May 2, 2002
View Article titled, Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board
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Topics: Deflection, Laminates, Printed circuit boards, Stress, Nonlinear dynamics, Stress analysis (Engineering), Deformation, Equations of motion, Resonance
Journal Articles

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

Yarom Polsky, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 1–5.
https://doi.org/10.1115/1.1343111
Published Online: November 29, 2000
View Article titled, Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards
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Topics: Deflection, Lamination, Plane strain, Printed circuit boards, Shear (Mechanics), Shear deformation, Stress, Temperature, Warping, Laminates
Journal Articles

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Weidong Xie, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 61–66.
https://doi.org/10.1115/1.483133
Published Online: December 12, 1999
View Article titled, Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures
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Topics: Laminates, Stress, Thermal stresses, Shapes, Anisotropy, Electronic packaging
Journal Articles

The Impact of Interfacial Adhesion on PTH and Via Stress State

G. Subbarayan, K. Ramakrishna, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 260–267.
https://doi.org/10.1115/1.2792247
Published Online: December 1, 1997
View Article titled, The Impact of Interfacial Adhesion on PTH and Via Stress State
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Topics: Adhesion, Stress, Laminates, Fracture (Materials), Fracture (Process), Plating, Drills (Tools), Finite element analysis, Junctions, Manufacturing
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem

Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 153–158.
https://doi.org/10.1115/1.2792083
Published Online: June 1, 1995
View Article titled, Interfacial Thermal Stresses in Layered Structures: The Stepped Edge Problem
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Topics: Bonding, Geometry, Junctions, Laminates, Shear stress, Silicon chips, Stress, Temperature, Thermal stresses
Journal Articles

Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors

P. E. Phelan, M. N. Ghasemi Nejhad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 249–257.
https://doi.org/10.1115/1.2905695
Published Online: December 1, 1994
View Article titled, Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors
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Topics: High temperature superconductors, Residual stresses, Thin films, Oxygen, Stress, Dimensions, Shrinkage (Materials), Stoichiometry, Temperature, Thermal expansion
Journal Articles

An Experimental Investigation of Deformation of Plated Holes for a Single 30-210-30°C Thermal Cycle

T. S. Gross, J. A. Perault, D. W. Watt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 1–5.
https://doi.org/10.1115/1.2905488
Published Online: March 1, 1994
View Article titled, An Experimental Investigation of Deformation of Plated Holes for a Single 30-210-30°C Thermal Cycle
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Topics: Cycles, Deformation, Temperature, Stress, Elastic analysis, Finite element model, Laminates, Compression, Deflection, Displacement
Journal Articles

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

R. K. Agarwal, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 219–224.
https://doi.org/10.1115/1.2909321
Published Online: June 1, 1993
View Article titled, Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
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Topics: Composite materials, Design, Electrical properties, Printed circuit boards, Textiles, Boundary-value problems, Epoxy adhesives, Epoxy resins, Finite element methods, Glass