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Journal Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Yuan Chen, Zhongyang Wang, Yuhui Fan, Ming Dong, Dengxue Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030801.
Paper No: EP-23-1037
https://doi.org/10.1115/1.4064361
Published Online: March 8, 2024
View Article titled, Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
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Topics: Imaging, Inspection, Lasers, Microelectronic packaging, Resolution (Optics), Nondestructive evaluation, Microscopy
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Article titled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path

Ahmet Mete Muslu, Burak Ozluk, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011007.
Paper No: EP-19-1020
https://doi.org/10.1115/1.4047381
Published Online: June 23, 2020
View Article titled, An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path
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Topics: Domes (Structural elements), Heat, Junctions, Light-emitting diodes, Temperature, Currents, Imaging, Temperature measurement
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages
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Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes

G. Rodriguez, D. F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 169–178.
https://doi.org/10.1115/1.2792680
Published Online: September 1, 1999
View Article titled, Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes
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Topics: Printing, Solders, Electronic packaging, Adhesives, Analytical methods, Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Imaging, Measurement systems
Journal Articles

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

A. K. Mallik, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 75–81.
https://doi.org/10.1115/1.2792070
Published Online: March 1, 1995
View Article titled, Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Steady state, Vapors, Semiconductor wafers, Temperature, Temperature distribution, Temperature gradient, Thermal conductivity, Computer simulation, Flux (Metallurgy)
Journal Articles

Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays

G. P. Peterson, A. K. Mallik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 82–87.
https://doi.org/10.1115/1.2792072
Published Online: March 1, 1995
View Article titled, Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays
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Topics: Heat pipes, Transients (Dynamics), Vapors, Semiconductor wafers, Computer simulation, Condensation, Imaging, Semiconductor device reliability, Temperature, Temperature gradient