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Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Article titled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020911.
Paper No: EP-16-1144
https://doi.org/10.1115/1.4036442
Published Online: June 12, 2017
View Article titled, Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections
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Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating
Journal Articles

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031001.
Paper No: EP-11-1060
https://doi.org/10.1115/1.4029931
Published Online: September 1, 2015
View Article titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Annealing, Copper, Grain boundaries, Thin films, Electrical properties, Electron backscatter diffraction
Journal Articles

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
https://doi.org/10.1115/1.4003990
Published Online: June 23, 2011
View Article titled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
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Topics: Electronic packaging, Stainless steel, Surface finishing, Grain boundaries, Grain size, X-ray diffraction, X-ray analysis
Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
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Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips
Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Pradeep Sharma, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 292–297.
https://doi.org/10.1115/1.1493202
Published Online: July 26, 2002
View Article titled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
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Topics: Creep, Damage, Fatigue, Grain boundaries, Nucleation (Physics), Solders, Stress, Particulate matter, Micromechanics (Engineering)
Journal Articles

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
https://doi.org/10.1115/1.1451845
Published Online: May 2, 2002
View Article titled, A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders
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Topics: Constitutive equations, Creep, Deformation, Dislocations, Grain boundaries, Grain size, Solders, Stress tensors, Temperature
Journal Articles

Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach

Ahmer R. Syed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 116–122.
https://doi.org/10.1115/1.2792077
Published Online: June 1, 1995
View Article titled, Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach
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Topics: Creep, Fracture (Materials), Solder joints, Temperature, Damage, Density, Fatigue life, Finite element analysis, Grain boundaries, Ceramics
Journal Articles

Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

S.-M. Lee, D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 118–121.
https://doi.org/10.1115/1.2906407
Published Online: June 1, 1992
View Article titled, Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading
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Topics: Deformation, Fatigue, Fracture (Materials), Tin, Failure, Cavitation, Displacement, Fatigue testing, Grain boundaries, Compression
Journal Articles

A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics

S. Russell, R. Caroselli, J. Mason, M. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 122–127.
https://doi.org/10.1115/1.2906408
Published Online: June 1, 1992
View Article titled, A Conjectured Solder Fatigue Law Based on Nonlinear Dynamics
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Topics: Fatigue, Nonlinear dynamics, Solders, Creep, Bifurcation, Chaos theory, Deformation, Engineering disciplines, Grain boundaries, Grain size
Journal Articles

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 109–114.
https://doi.org/10.1115/1.2905375
Published Online: June 1, 1991
View Article titled, Superplastic Creep of Eutectic Tin-Lead Solder Joints
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Topics: Creep, Solder joints, Superplasticity, Stress, Cooling, Dislocations, Grain boundaries, Nitrogen, Recrystallization, Steady state
Journal Articles

Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing

H. K. Charles, Jr., G. V. Clatterbaugh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 135–146.
https://doi.org/10.1115/1.2904354
Published Online: June 1, 1990
View Article titled, Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing
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Topics: Design, Finite element analysis, Modeling, Reliability, Solder joints, Testing, Fatigue life, Stress, Fracture toughness, Temperature
Journal Articles

The Creep-Fatigue Interaction in Solders and Solder Joints

D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 100–103.
https://doi.org/10.1115/1.2904348
Published Online: June 1, 1990
View Article titled, The Creep-Fatigue Interaction in Solders and Solder Joints
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Topics: Creep, Fatigue, Solder joints, Solders, Fatigue cracks, Failure, Fatigue life, Grain boundaries, Cycles, Grain size
Journal Articles

Oxidation of (Pb, Sn) and (Pb, In) Alloys

R. A. Konetzki, M. X. Zhang, D. A. Sluzewski, Y. A. Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 175–178.
https://doi.org/10.1115/1.2904359
Published Online: June 1, 1990
View Article titled, Oxidation of (Pb, Sn) and (Pb, In) Alloys
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Topics: Alloys, Oxidation, Tin, Augers, Grain boundaries, Diffusion (Physics), Electron spectroscopy, Eutectic alloys, Indium alloys, Temperature