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Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
View Article titled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
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Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Journal Articles

An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions

Di Zhang, Lu Zheng, Gongnan Xie, Yonghui Xie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021005.
Paper No: EP-13-1079
https://doi.org/10.1115/1.4025713
Published Online: April 29, 2014
View Article titled, An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions
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Topics: Flow (Dynamics), Fluids, Heat transfer, Non-Newtonian fluids, Viscosity, Friction, Shear (Mechanics)
Journal Articles

Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices

Thomas Fellner, Elena Zukowski, Jürgen Wilde, H. Kück, H. Richter, M. Schober, P. Buckmüller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031002.
https://doi.org/10.1115/1.4006927
Published Online: July 18, 2012
View Article titled, Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
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Topics: Creep, Modeling, Press fits, Reliability, Simulation, Stress, Temperature, Deformation, Friction, Manufacturing
Journal Articles

Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins

Christopher A. Konishi, Weilin Qu, Frank E. Pfefferkorn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
https://doi.org/10.1115/1.3104028
Published Online: April 3, 2009
View Article titled, Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins
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Topics: Fins, Flow (Dynamics), Pressure drop, Vapors, Water, Friction, Two-phase flow
Journal Articles

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
https://doi.org/10.1115/1.2957330
Published Online: July 30, 2008
View Article titled, Analysis of Solderless Press-Fit Interconnections During the Assembly Process
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Topics: Finite element analysis, Manufacturing, Pins (Engineering), Press fits, Stress, Friction
Journal Articles

Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink

Abel Siu-Ho, Weilin Qu, Frank Pfefferkorn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 479–487.
https://doi.org/10.1115/1.2804099
Published Online: May 14, 2007
View Article titled, Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink
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Topics: Flow (Dynamics), Friction, Heat sinks, Heat transfer, Pressure drop, Reynolds number, Water, Fins, Temperature, Heat flux
Journal Articles

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Li Zhang, Vijaylaxmi Gumaste, Anindya Poddar, Luu Nguyen, Gary Schulze
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 391–399.
https://doi.org/10.1115/1.2753886
Published Online: November 28, 2006
View Article titled, Analytical and Experimental Characterization of Bonding Over Active Circuitry
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Topics: Bonding, Fracture (Materials), Friction, Stress, Ultrasound, Wire, Finite element analysis, Finite element model
Journal Articles

Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling

Carlos Silva, Egidio Marotta, Leroy Fletcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 157–166.
https://doi.org/10.1115/1.2721087
Published Online: July 3, 2006
View Article titled, Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling
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Topics: Channel flow, Computer simulation, Cooling, Design, Flow (Dynamics), Friction, Heat sinks, Heat transfer, Reynolds number, Geometry
Journal Articles

Effects of Two-Dimensional Roughness in Flow in Microchannels

Xiang-Qi Wang, Christopher Yap, Arun Sadashiv Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
https://doi.org/10.1115/1.1997164
Published Online: August 5, 2004
View Article titled, Effects of Two-Dimensional Roughness in Flow in Microchannels
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Topics: Poiseuille flow, Surface roughness, Friction, Flow (Dynamics), Microchannels
Journal Articles

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

Chang-Yuan Liu, Graduate Student, Ying-Huei Hung, Professor and Chairman, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 104–113.
https://doi.org/10.1115/1.1536170
Published Online: March 14, 2003
View Article titled, Heat Transfer and Flow Friction Characteristics for Compact Cold Plates
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Topics: Flow (Dynamics), Heat transfer, Plates (structures), Temperature, Thermal resistance, Heat flux, Pressure drop, Friction, Heat, Reynolds number
Journal Articles

Random Change of Vibration Modes in Thermosonic Bonding

S.-Y. Kang, K. Chuang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 253–258.
https://doi.org/10.1115/1.2792630
Published Online: September 1, 1998
View Article titled, Random Change of Vibration Modes in Thermosonic Bonding
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Topics: Bonding, Vibration, Friction, End effectors, Excitation, Flip-chip assemblies, Generators, Modal analysis, Process control, Resonance
Journal Articles

Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages

R. A. Wirtz, D. M. Colban
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 27–30.
https://doi.org/10.1115/1.2792123
Published Online: March 1, 1996
View Article titled, Comparison of the Cooling Performance of Staggered and In-Line Arrays of Electronic Packages
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Topics: Cooling, Electronic packages, Flow (Dynamics), Friction, Heat transfer coefficients, Packaging, Coolants, Heat transfer, Packaging density (Electronics), Pressure drop
Journal Articles

Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

S. H. Kim, N. K. Anand
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 52–62.
https://doi.org/10.1115/1.2792067
Published Online: March 1, 1995
View Article titled, Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources
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Topics: Heat, Heat transfer, Plates (structures), Thermal resistance, Friction, Air flow, Cooling, Electrical conductivity, Electronic equipment, Flow (Dynamics)
Journal Articles

Analysis of Insertion Force in Elastic/Plastic Mating

S. E. Yamada, H. Ueno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 192–197.
https://doi.org/10.1115/1.2904366
Published Online: September 1, 1990
View Article titled, Analysis of Insertion Force in Elastic/Plastic Mating
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Topics: Deformation, Electronic systems, Equilibrium (Physics), Friction, Simulation
Journal Articles

Oil Films on Electroplated Gold Contact Surfaces

R. G. Bayer, K. M. Conrow, P. A. Lazarou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 236–240.
https://doi.org/10.1115/1.3226539
Published Online: September 1, 1989
View Article titled, Oil Films on Electroplated Gold Contact Surfaces
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Topics: Coating processes, Coatings, Friction, Lubricants, Metallurgy, Microscopy, Polarization (Light), Shapes, Wear
Journal Articles

Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector

P. A. Engel, S. E. Nemier, M. D. Toda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 9–15.
https://doi.org/10.1115/1.3226513
Published Online: March 1, 1989
View Article titled, Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector
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Topics: Circuits, Deformation, Design, Finite element analysis, Friction, Plasticity, Probability, Springs, Stress, Stress analysis (Engineering)