1-20 of 28
Fracture mechanics
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Article titled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
Open the PDF for Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures in another window
Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
Open the PDF for Review of Methodologies for Structural Integrity Evaluation of Power Modules in another window
Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Dominiek Degryse, Bart Vandevelde, Eric Beyne, Joris Degrieck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041003.
https://doi.org/10.1115/1.4000209
Published Online: October 21, 2009
View Article titled, The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface
Open the PDF for The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface in another window
Topics: Fracture (Materials), Shear (Mechanics), Modeling, Fracture mechanics
Journal Articles

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
https://doi.org/10.1115/1.2840057
Published Online: April 15, 2008
View Article titled, A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
Open the PDF for A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints in another window
Topics: Fatigue, Fatigue cracks, Fracture (Materials), Fracture mechanics, Modeling, Solder joints, Solders, Tin, Damage, Creep
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Article titled, Hygrothermal Cracking Analysis of Plastic IC Package
Open the PDF for Hygrothermal Cracking Analysis of Plastic IC Package in another window
Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

Research of Underfill Delamination in Flip Chip by the J -Integral Method

Bulu Xu, Xia Cai, Weidong Huang, Zhaonian Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
https://doi.org/10.1115/1.1648061
Published Online: April 30, 2004
View Article titled, Research of Underfill Delamination in Flip Chip by the J -Integral Method
Open the PDF for Research of Underfill Delamination in Flip Chip by the J -Integral Method in another window
Topics: Delamination, Finite element analysis, Flip-chip, Flip-chip assemblies, Fracture (Materials), Simulation, Fracture mechanics, Flip-chip devices, Crack propagation, Cycles
Journal Articles

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 420–425.
https://doi.org/10.1115/1.1602706
Published Online: September 17, 2003
View Article titled, Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading
Open the PDF for Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading in another window
Topics: Delamination, Fracture (Process), Resins, Temperature, Copper alloys, Fracture mechanics, Alloys, Radioactive tracers, Wedges, Cracking (Materials)
Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
https://doi.org/10.1115/1.1520430
Published Online: March 14, 2003
View Article titled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
Open the PDF for Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages in another window
Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress
Journal Articles

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
https://doi.org/10.1115/1.1497626
Published Online: December 12, 2002
View Article titled, Special Issue on Poly’2000, London
Open the PDF for Special Issue on Poly’2000, London in another window
Topics: Adhesion, Adhesives, Fracture mechanics, Integrated circuit packaging, Packaging, Polymers, Reliability, Stress, Thermal management, Workshops (Work spaces)
Journal Articles

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

J. Auersperg, E. Kieselstein, A. Schubert, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 318–322.
https://doi.org/10.1115/1.1501303
Published Online: December 12, 2002
View Article titled, Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches
Open the PDF for Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches in another window
Topics: Delamination, Finite element analysis, Fracture (Materials), Fracture mechanics, Stress, Fracture toughness, Reliability, Fracture (Process), Integrated circuits, Risk assessment
Journal Articles

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Qizhou Yao, Jianmin Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
https://doi.org/10.1115/1.1459470
Published Online: May 2, 2002
View Article titled, Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness
Open the PDF for Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness in another window
Topics: Adhesion, Electronic packaging, Failure, Fracture (Materials), Metals, Polymers, Surface roughness, Interface roughness, Aluminum, Fracture mechanics
Journal Articles

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
https://doi.org/10.1115/1.1289998
Published Online: June 20, 2000
View Article titled, Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills
Open the PDF for Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills in another window
Topics: Corners (Structural elements), Delamination, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture mechanics, Solder joints, Solder masks, Solders, Stress
Journal Articles

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 67–72.
https://doi.org/10.1115/1.483137
Published Online: December 9, 1999
View Article titled, Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages
Open the PDF for Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages in another window
Topics: Design, Electronic packages, Electronic packaging, Fracture (Materials), Fracture (Process), Fracture toughness, Stress, Testing, Geometry, Packaging
Journal Articles

Flip-Chip BGA Design to Avert Die Cracking

J.-B. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
https://doi.org/10.1115/1.1329130
Published Online: October 29, 1999
View Article titled, Flip-Chip BGA Design to Avert Die Cracking
Open the PDF for Flip-Chip BGA Design to Avert Die Cracking in another window
Topics: Ball-Grid-Array packaging, Design, Finite element analysis, Flip-chip, Fracture (Materials), Fracture (Process), Fracture mechanics, Cracking (Materials)
Journal Articles

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

Adam Kuhl, Jianmin Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 147–151.
https://doi.org/10.1115/1.483147
Published Online: September 15, 1999
View Article titled, A Technique to Measure Interfacial Toughness Over a Range of Phase Angles
Open the PDF for A Technique to Measure Interfacial Toughness Over a Range of Phase Angles in another window
Topics: Adhesives, Fracture (Materials), Fracture mechanics, Fracture toughness, Stress, Finite element analysis, Testing
Journal Articles

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Kang Yong Lee, Taek Sung Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 148–155.
https://doi.org/10.1115/1.2792677
Published Online: September 1, 1999
View Article titled, Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process
Open the PDF for Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process in another window
Topics: Fracture (Materials), Fracture (Process), Reflow soldering, Delamination, Design, Finite difference methods, Fracture mechanics, Heating, Integrated circuits, Shapes
Journal Articles

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

John H. Lau, Fellow ASME, S. W. Ricky Lee, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 34–41.
https://doi.org/10.1115/1.483129
Published Online: August 31, 1999
View Article titled, Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method
Open the PDF for Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method in another window
Topics: Fracture (Materials), Fracture mechanics, Temperature, Stress, Copper, Solder masks
Journal Articles

Special Section on the Application of Fracture Mechanics in Electronic Packaging

David T. Read
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Preface
J. Electron. Packag. December 1998, 120(4): 321.
https://doi.org/10.1115/1.2792640
Published Online: December 1, 1998
View Article titled, Special Section on the Application of Fracture Mechanics in Electronic Packaging
Open the PDF for Special Section on the Application of Fracture Mechanics in Electronic Packaging in another window
Topics: Electronic packaging, Fracture mechanics
Journal Articles

Adhesion and Reliability of Polymer/Inorganic Interfaces

S.-Y. Kook, J. M. Snodgrass, A. Kirtikar, R. H. Dauskardt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 328–335.
https://doi.org/10.1115/1.2792642
Published Online: December 1, 1998
View Article titled, Adhesion and Reliability of Polymer/Inorganic Interfaces
Open the PDF for Adhesion and Reliability of Polymer/Inorganic Interfaces in another window
Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Journal Articles

Life Prediction of Solder Joints by Damage and Fracture Mechanics

S. H. Ju, B. I. Sandor, M. E. Plesha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 193–200.
https://doi.org/10.1115/1.2792152
Published Online: December 1, 1996
View Article titled, Life Prediction of Solder Joints by Damage and Fracture Mechanics
Open the PDF for Life Prediction of Solder Joints by Damage and Fracture Mechanics in another window
Topics: Damage, Fracture mechanics, Solder joints, Fracture (Materials), Damage mechanics, Fatigue life, Computers, Fatigue, Finite element methods, Anisotropy