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Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041111.
Paper No: EP-24-1027
https://doi.org/10.1115/1.4065947
Published Online: August 9, 2024
View Article titled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling
Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031006.
Paper No: EP-19-1118
https://doi.org/10.1115/1.4049564
Published Online: February 19, 2021
View Article titled, Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes
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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)
Journal Articles

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031009.
Paper No: EP-14-1104
https://doi.org/10.1115/1.4030643
Published Online: September 1, 2015
View Article titled, Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate
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Topics: Cooling, Flow (Dynamics), Heat, Manufacturing, Microchannels, Microfluidics, Resistors, Temperature, Thermal resistance, Water
Journal Articles

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Kyoung Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011002.
Paper No: EP-13-1047
https://doi.org/10.1115/1.4025673
Published Online: November 22, 2013
View Article titled, Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules
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Topics: Forced convection, Heat sinks, Light-emitting diodes, Natural convection, Temperature, Heat
Journal Articles

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

M. O. Özdemir, H. Yüncü
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004097
Published Online: September 14, 2011
View Article titled, Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards
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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Lumber, Optimization, Pressure, Pressure drop, Temperature, Laminar flow
Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
https://doi.org/10.1115/1.4003217
Published Online: March 3, 2011
View Article titled, Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Article titled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
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Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Anthony G. Straatman, Lee J. Betchen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
https://doi.org/10.1115/1.3103934
Published Online: March 27, 2009
View Article titled, Modeling Forced Convection in Finned Metal Foam Heat Sinks
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Topics: Aluminum, Computational fluid dynamics, Fins, Heat sinks, Heat transfer, Thermal conductivity, Fluids, Flow (Dynamics), Metal foams, Forced convection
Journal Articles

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

E. Elsaadawy, H. Mortazavi, M. S. Hamed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031011.
https://doi.org/10.1115/1.2912182
Published Online: August 5, 2008
View Article titled, Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
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Topics: Turbulence, Forced convection, Shear stress
Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 305–310.
https://doi.org/10.1115/1.2351891
Published Online: February 10, 2006
View Article titled, A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
Open the PDF for A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages in another window
Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution
Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
https://doi.org/10.1115/1.2065727
Published Online: April 20, 2005
View Article titled, Meso Scale Pulsating Jets for Electronics Cooling
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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling
Journal Articles

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Jeffrey Rambo, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 452–459.
https://doi.org/10.1115/1.2056575
Published Online: February 11, 2005
View Article titled, Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
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Topics: Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

H. Bhowmik, C. P. Tso, K. W. Tou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 215–222.
https://doi.org/10.1115/1.1938207
Published Online: August 9, 2004
View Article titled, Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel
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Topics: Computer simulation, Convection, Flow (Dynamics), Forced convection, Heat, Water, Heat flux, Fluids, Laminar flow, Reynolds number
Journal Articles

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

H. Bhowmik, K. W. Tou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 193–199.
https://doi.org/10.1115/1.1997155
Published Online: July 13, 2004
View Article titled, An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel
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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Laminar flow, Pumps, Temperature, Transient heat transfer, Transients (Dynamics), Water
Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 475–479.
https://doi.org/10.1115/1.1615796
Published Online: December 15, 2003
View Article titled, A Vapotron Effect Application for Electronic Equipment Cooling
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Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature
Journal Articles

Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

Octavio Leon, Gilbert De Mey, Erik Dick, Jan Vierendeels
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 442–446.
https://doi.org/10.1115/1.1602709
Published Online: September 17, 2003
View Article titled, Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling
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Topics: Cooling, Fins, Flow (Dynamics), Pressure drop, Heat, Heat transfer, Heat sinks, Coolants, Forced convection
Journal Articles

Local Heat Transfer Characteristics in Simulated Electronic Modules

Seong-Yeon Yoo, Jong-Hark Park, Min-Ho Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 362–368.
https://doi.org/10.1115/1.1602478
Published Online: September 17, 2003
View Article titled, Local Heat Transfer Characteristics in Simulated Electronic Modules
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Topics: Generators, Heat transfer, Vortices, Flow (Dynamics), Heat transfer coefficients, Wakes, Forced convection
Journal Articles

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Adrian Bejan, Fellow ASME, J. A. Jones Professor of Mechanical Engineering,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 200–207.
https://doi.org/10.1115/1.1566970
Published Online: June 10, 2003
View Article titled, Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection
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Topics: Boundary layers, Cooling, Flow (Dynamics), Forced convection, Heat, Natural convection, Temperature, Fluids, Design, Plates (structures)
Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 235–243.
https://doi.org/10.1115/1.1569507
Published Online: June 10, 2003
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
Open the PDF for On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate in another window
Topics: Cooling, Electrical conductivity, Electronic components, Flow (Dynamics), Forced convection, Heat, Heat conduction, Heat transfer, Temperature, Thermal conductivity