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Journal Articles

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021008.
Paper No: EP-19-1006
https://doi.org/10.1115/1.4046555
Published Online: March 18, 2020
View Article titled, Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
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Topics: Ball-Grid-Array packaging, Epoxy resins, Failure, Fatigue, Finite element analysis, Printed circuit boards, Cycles, Fatigue failure
Journal Articles

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

John H. L. Pang, F. X. Che
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
https://doi.org/10.1115/1.2809442
Published Online: August 27, 2007
View Article titled, Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
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Topics: Cycles, Density, Displacement, Fatigue, Fatigue testing, Finishes, Finite element analysis, High temperature, Lead-free solders, Manufacturing
Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
https://doi.org/10.1115/1.1827271
Published Online: January 24, 2005
View Article titled, Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis
Journal Articles

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Cemal Basaran, Associate Professor, Yujun Wen, Ph.D. Candidate
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
https://doi.org/10.1115/1.1602707
Published Online: September 17, 2003
View Article titled, Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
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Topics: Ball-Grid-Array packaging, Finite element analysis, Modeling, Reliability, Solder joints, Solders, Temperature, Tin, Surface mount technology, Diffusion (Physics)
Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Article titled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 294–300.
https://doi.org/10.1115/1.2792252
Published Online: December 1, 1997
View Article titled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration
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Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure
Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

C. S. Desai, J. Chia, T. Kundu, J. L. Prince
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 301–309.
https://doi.org/10.1115/1.2792253
Published Online: December 1, 1997
View Article titled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design
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Topics: Constitutive equations, Design, Electronic packaging, Thermomechanics, Failure, Fatigue, Fatigue failure, Modeling, Solders, Stress
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Sidharth, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 244–249.
https://doi.org/10.1115/1.2792159
Published Online: December 1, 1996
View Article titled, Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
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Topics: Corners (Structural elements), Fatigue life, Vibration, Stress, Displacement, Finite element analysis, Avionics, Boundary-value problems, Electronic packages, Electronic packaging
Journal Articles

Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 164–169.
https://doi.org/10.1115/1.2792147
Published Online: September 1, 1996
View Article titled, Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity
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Topics: Constitutive equations, Fatigue failure, Solders, Viscoplasticity, Alloys, Deformation, Density, Compression, Creep, Fatigue life
Journal Articles

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 72–79.
https://doi.org/10.1115/1.2792135
Published Online: June 1, 1996
View Article titled, A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints
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Topics: Solder joints, Stress analysis (Engineering), Surface mount packaging, Stress, Fatigue, Creep, Electronic packages, Deformation, Finite element analysis, Modeling
Journal Articles

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 62–66.
https://doi.org/10.1115/1.2792133
Published Online: June 1, 1996
View Article titled, A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints
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Topics: Fatigue failure, Solder joints, Tin, Coatings, Failure, Agglomeration (Materials), Atoms, Cycles, Failure analysis, Melting
Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 141–146.
https://doi.org/10.1115/1.2792081
Published Online: June 1, 1995
View Article titled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias
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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Article titled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design
Journal Articles

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

L. T. Nguyen, M. Michael
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 225–232.
https://doi.org/10.1115/1.2909322
Published Online: September 1, 1993
View Article titled, Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
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Topics: Adhesion, Acoustics, Cracking (Materials), Deformation, Delamination, Design, Epoxy adhesives, Epoxy resins, Fatigue failure, Finite element analysis
Journal Articles

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 34–38.
https://doi.org/10.1115/1.2909299
Published Online: March 1, 1993
View Article titled, Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging
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Topics: Packaging, Simulation, Stress, Transients (Dynamics), Temperature, Thermal stresses, Composite materials, Delamination, Electronic equipment, Elongation
Journal Articles

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

Yifan Guo, Charles G. Woychik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 88–92.
https://doi.org/10.1115/1.2905446
Published Online: March 1, 1992
View Article titled, Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
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Topics: Interferometry, Solder joints, Strain measurement, Surface mount components, Reliability, Solders, Thermal expansion, Dimensions, Electronic packages, Failure
Journal Articles

A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics

Jun Ming Hu, Michael Pecht, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 275–285.
https://doi.org/10.1115/1.2905407
Published Online: September 1, 1991
View Article titled, A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics
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Topics: Fatigue life, Microelectronic devices, Wire bonding, Wire, Fatigue failure, Reliability, Stress, Temperature, Uncertainty, Bonding
Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

Yoshiki Oshida, P. C. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 58–62.
https://doi.org/10.1115/1.2905367
Published Online: March 1, 1991
View Article titled, High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
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Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films