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Journal Articles

Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions

J. Liang, N. Dariavach, P. Callahan, D. Shangguan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
https://doi.org/10.1115/1.2721593
Published Online: June 23, 2006
View Article titled, Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions
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Topics: Alloys, Creep, Deformation, Eutectic alloys, Solders, Stress, Temperature, Tin, Die cutting, Shearing (Deformation)
Journal Articles

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

Qiang Xiao, Harold J. Bailey, William D. Armstrong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
https://doi.org/10.1115/1.1756144
Published Online: July 8, 2004
View Article titled, Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
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Topics: Alloys, Solders, Temperature, Eutectic alloys, Lead-free solders, Tin, Hardening, Tensile strength
Journal Articles

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Y.-L. Shen, W. Li, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
https://doi.org/10.1115/1.1324673
Published Online: June 29, 2000
View Article titled, Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis
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Topics: Alloys, Deformation, Shear (Mechanics), Stress, Fatigue, Tin, Damage, Eutectic alloys, Cycles, Modeling
Journal Articles

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
https://doi.org/10.1115/1.483136
Published Online: March 1, 2000
View Article titled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]
Open the PDF for Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185] in another window
Topics: Alloys, Electrons, Mechanical properties, Solders, Temperature, Eutectic alloys, Soldering, Stress-strain relations, Thermomechanical treatment
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

Creep in Shear of Experimental Solder Joints

D. Tribula, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 87–93.
https://doi.org/10.1115/1.2904363
Published Online: June 1, 1990
View Article titled, Creep in Shear of Experimental Solder Joints
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Topics: Creep, Shear (Mechanics), Solder joints, Fatigue, Temperature, Fatigue failure, Solders, Tin, Alloys, Electronics
Journal Articles

Oxidation of (Pb, Sn) and (Pb, In) Alloys

R. A. Konetzki, M. X. Zhang, D. A. Sluzewski, Y. A. Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 175–178.
https://doi.org/10.1115/1.2904359
Published Online: June 1, 1990
View Article titled, Oxidation of (Pb, Sn) and (Pb, In) Alloys
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Topics: Alloys, Oxidation, Tin, Augers, Grain boundaries, Diffusion (Physics), Electron spectroscopy, Eutectic alloys, Indium alloys, Temperature