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Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
https://doi.org/10.1115/1.1648059
Published Online: April 30, 2004
View Article titled, A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
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Topics: Adhesives, Deformation, Relaxation (Physics), Reliability, Stress, Temperature, Design, Glass transition, Elasticity
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Article titled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
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Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Z. Qian, W. Ren, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 162–168.
https://doi.org/10.1115/1.2792679
Published Online: September 1, 1999
View Article titled, A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
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Topics: Alloys, Damage, Fatigue, Solders, Viscoplasticity, Constitutive equations, Creep, Damage mechanics, Deformation, Elasticity
Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
https://doi.org/10.1115/1.1289635
Published Online: August 9, 1999
View Article titled, Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
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Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)
Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
https://doi.org/10.1115/1.2792279
Published Online: March 1, 1998
View Article titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Article titled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
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Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses
Journal Articles

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

J. K. Shang, Daping Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 170–173.
https://doi.org/10.1115/1.2792148
Published Online: September 1, 1996
View Article titled, Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints
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Topics: Fatigue cracks, Interface roughness, Solder joints, Tin, Fracture (Materials), Elasticity, Fracture mechanics, Intermetallic compounds, Shear strength, Solders
Journal Articles

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 208–213.
https://doi.org/10.1115/1.2909319
Published Online: June 1, 1993
View Article titled, The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam
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Topics: Thermal stresses, Stress, Elasticity, Polynomials, Stress singularity, Variational techniques, Wedges
Journal Articles

Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips

Mikyoung Lee, I. Jasiuk
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 173–177.
https://doi.org/10.1115/1.2905383
Published Online: June 1, 1991
View Article titled, Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips
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Topics: Strips, Thermal stresses, Stress, Elasticity, Temperature
Journal Articles

Realistic Modeling of Edge Effect Stresses in Bimaterial Elements

J. W. Eischen, C. Chung, J. H. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 16–23.
https://doi.org/10.1115/1.2904333
Published Online: March 1, 1990
View Article titled, Realistic Modeling of Edge Effect Stresses in Bimaterial Elements
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Topics: Modeling, Stress, Aluminum, Elasticity, Strength (Materials), Design, Eigenfunctions, Electronics, Finite element analysis, Shear (Mechanics)
Journal Articles

Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data

D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 41–46.
https://doi.org/10.1115/1.2904339
Published Online: March 1, 1990
View Article titled, Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data
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Topics: Elastic moduli, Elasticity, Thin films, Borosilicate glasses, Computers, Crystals, Engineering simulation, Glass, Heat resistant glass, Simulation