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Journal Articles

Interfacial Fracture Caused by Electromigration at Copper Interconnects

Yuexing Wang, Bofeng Li, Yao Zhifeng, Yao Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011007.
Paper No: EP-23-1034
https://doi.org/10.1115/1.4062828
Published Online: July 14, 2023
View Article titled, Interfacial Fracture Caused by Electromigration at Copper Interconnects
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Topics: Copper, Electrodiffusion, Fracture (Materials), Fracture (Process), Stress, Fracture toughness, Dislocations, Anodes
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Article titled, Effective Constitutive Relations for Sintered Nano Copper Joints
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
https://doi.org/10.1115/1.4051728
Published Online: September 15, 2021
View Article titled, Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Article titled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Article titled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
https://doi.org/10.1115/1.1451845
Published Online: May 2, 2002
View Article titled, A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders
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Topics: Constitutive equations, Creep, Deformation, Dislocations, Grain boundaries, Grain size, Solders, Stress tensors, Temperature
Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Z. Guo, Yi-Hsin Pao, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 100–104.
https://doi.org/10.1115/1.2792074
Published Online: June 1, 1995
View Article titled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
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Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature
Journal Articles

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Q. Guo, E. C. Cutiongco, L. M. Keer, M. E. Fine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 145–151.
https://doi.org/10.1115/1.2906411
Published Online: June 1, 1992
View Article titled, Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
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Topics: Fatigue life, Solders, Thermomechanics, Failure, Fatigue testing, Cycles, Fatigue, Compressive stress, Dislocations, Stress
Journal Articles

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

Z. Guo, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 112–117.
https://doi.org/10.1115/1.2906406
Published Online: June 1, 1992
View Article titled, Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue
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Topics: Deformation, Low cycle fatigue, Solder joints, Tin, Stress, Alloys, Dislocations, Shear (Mechanics)
Journal Articles

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 109–114.
https://doi.org/10.1115/1.2905375
Published Online: June 1, 1991
View Article titled, Superplastic Creep of Eutectic Tin-Lead Solder Joints
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Topics: Creep, Solder joints, Superplasticity, Stress, Cooling, Dislocations, Grain boundaries, Nitrogen, Recrystallization, Steady state
Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

Yoshiki Oshida, P. C. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 58–62.
https://doi.org/10.1115/1.2905367
Published Online: March 1, 1991
View Article titled, High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
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Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films