1-20 of 49
Dimensions
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach in another window
Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
https://doi.org/10.1115/1.4036384
Published Online: June 12, 2017
View Article titled, Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Open the PDF for Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications in another window
Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design
Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Article titled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
Open the PDF for Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics in another window
Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability

J. F. Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
https://doi.org/10.1115/1.4027338
Published Online: April 29, 2014
View Article titled, Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability
Open the PDF for Development of a Mini Heat Sink Model With Homogeneous Heat Transfer Capability in another window
Topics: Design, Dimensions, Heat sinks, Heat transfer, Ducts, Microchannels, Cooling
Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021003.
Paper No: EP-12-1032
https://doi.org/10.1115/1.4023292
Published Online: March 28, 2013
View Article titled, Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
Open the PDF for Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies in another window
Topics: Cooling, Heat, Heat transfer coefficients, Temperature, Heat conduction, Heat sinks, Dimensions
Journal Articles

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
https://doi.org/10.1115/1.2993126
Published Online: November 14, 2008
View Article titled, Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
Open the PDF for Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach in another window
Topics: Copper, Flow (Dynamics), Heat, Heat conduction, Insulation, Laminates, Modeling, Printed circuit boards, Resins, Temperature
Journal Articles

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
https://doi.org/10.1115/1.2351900
Published Online: February 20, 2006
View Article titled, Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
Open the PDF for Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards in another window
Topics: Cooling, Dimensions, Heat transfer, Jets, Printed circuit boards, Diaphragms (Mechanical devices), Diaphragms (Structural), Thermal management, Flow (Dynamics), Fluid mechanics
Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
https://doi.org/10.1115/1.1827262
Published Online: January 24, 2005
View Article titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs
Open the PDF for Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs in another window
Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer
Journal Articles

A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks

Weilin Qu, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 381–390.
https://doi.org/10.1115/1.2056571
Published Online: December 17, 2004
View Article titled, A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks
Open the PDF for A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks in another window
Topics: Design, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Heat flux, Dimensions, Coolants, Temperature
Journal Articles

Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection

Valérie Eveloy, Peter Rodgers, M. S. J. Hashmi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 245–254.
https://doi.org/10.1115/1.1938988
Published Online: June 26, 2004
View Article titled, Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection
Open the PDF for Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection in another window
Topics: Computer simulation, Heat transfer, Junctions, Modeling, Natural convection, Temperature, Computational fluid dynamics, Dimensions, Vehicles
Journal Articles

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
https://doi.org/10.1115/1.1604150
Published Online: December 15, 2003
View Article titled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
Open the PDF for Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies in another window
Topics: Finite element analysis, Reliability, Simulation, Solder joints, Solders, Modeling, Thermomechanics, Sensitivity analysis, Design, Dimensions
Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 186–191.
https://doi.org/10.1115/1.1568126
Published Online: June 10, 2003
View Article titled, Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces
Open the PDF for Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces in another window
Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics
Journal Articles

Fundamental Performance Limits of Heatsinks

David Watabe Copeland
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 221–225.
https://doi.org/10.1115/1.1569262
Published Online: June 10, 2003
View Article titled, Fundamental Performance Limits of Heatsinks
Open the PDF for Fundamental Performance Limits of Heatsinks in another window
Topics: Flow (Dynamics), Thermal conductivity, Pressure drop, Dimensions, Fins, Cooling
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
Open the PDF for Measurement of Thermal Deformation of Interconnect Layers Using SIEM in another window
Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

J. R. Culham, Associate Professor and Director, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME, P. Teertstra, Research Associate, C.-S. Wang, G. Refai-Ahmed, Mem. ASME, Ra-Min Tain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 182–188.
https://doi.org/10.1115/1.1347993
Published Online: October 13, 2000
View Article titled, Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape
Open the PDF for Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape in another window
Topics: Boundary layers, Dimensions, Flat plates, Flow (Dynamics), Forced convection, Reynolds number, Shapes, Computer simulation, Heat transfer, Computational fluid dynamics
Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages
Open the PDF for Microwave Imaging for the Integrity Assessment of IC Packages in another window
Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

Yutaka Tsukada, Hideo Nishimura, Masao Sakane, Masateru Ohnami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 207–213.
https://doi.org/10.1115/1.1286002
Published Online: November 1, 1999
View Article titled, Fatigue Life Analysis of Solder Joints in Flip Chip Bonding
Open the PDF for Fatigue Life Analysis of Solder Joints in Flip Chip Bonding in another window
Topics: Bonding, Fatigue life, Finite element methods, Flip-chip, Flip-chip devices, Solder joints, Solders, Thermal stresses, Dimensions, Finite element analysis
Journal Articles

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, M. Behnia, W. Nakayama, H. Matsushima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 259–266.
https://doi.org/10.1115/1.2792631
Published Online: September 1, 1998
View Article titled, Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages
Open the PDF for Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages in another window
Topics: Electronic packages, Heat sinks, Impingement cooling, Optimization, Computational fluid dynamics, Design, Cooling, Dimensions, Electronic components, Engineering simulation
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Article titled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
Open the PDF for The Effects of Material Properties on Heat Dissipation in High Power Electronics in another window
Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation
Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
https://doi.org/10.1115/1.2792279
Published Online: March 1, 1998
View Article titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
Open the PDF for Shearing Deformation in Partial Areal Arrays: Analytical Results in another window
Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry