1-15 of 15
Die cutting
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
https://doi.org/10.1115/1.4005294
Published Online: December 21, 2011
View Article titled, Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
Open the PDF for Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change in another window
Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper
Journal Articles

Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions

J. Liang, N. Dariavach, P. Callahan, D. Shangguan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
https://doi.org/10.1115/1.2721593
Published Online: June 23, 2006
View Article titled, Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions
Open the PDF for Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions in another window
Topics: Alloys, Creep, Deformation, Eutectic alloys, Solders, Stress, Temperature, Tin, Die cutting, Shearing (Deformation)
Journal Articles

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

X. B. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 370–374.
https://doi.org/10.1115/1.2056568
Published Online: March 9, 2005
View Article titled, Time-Dependent Rheological Behavior of Fluids For Electronics Packaging
Open the PDF for Time-Dependent Rheological Behavior of Fluids For Electronics Packaging in another window
Topics: Die cutting, Electronic packaging, Fluids, Rheology, Shearing (Deformation), Viscosity, Shear rate, Flow (Dynamics), Adhesives
Journal Articles

An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

S. Shakya, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 74–81.
https://doi.org/10.1115/1.1648058
Published Online: April 30, 2004
View Article titled, An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Open the PDF for An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects in another window
Topics: Die cutting, Displacement, Manufacturing, Shear (Mechanics), Shear deformation, Shearing (Deformation), Solders, Stress, Temperature
Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
https://doi.org/10.1115/1.1520430
Published Online: March 14, 2003
View Article titled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
Open the PDF for Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages in another window
Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress
Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
https://doi.org/10.1115/1.2793857
Published Online: December 1, 1999
View Article titled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
Open the PDF for An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects in another window
Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model
Journal Articles

Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability

E. K. Buratynski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 221–228.
https://doi.org/10.1115/1.2792626
Published Online: September 1, 1998
View Article titled, Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability
Open the PDF for Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability in another window
Topics: Die cutting, Lamination, Reliability, Shearing (Deformation), Solder joints, Fatigue life, Shear (Mechanics), Silicon, Stress, Temperature
Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
https://doi.org/10.1115/1.2792279
Published Online: March 1, 1998
View Article titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
Open the PDF for Shearing Deformation in Partial Areal Arrays: Analytical Results in another window
Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Journal Articles

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 12–17.
https://doi.org/10.1115/1.2792278
Published Online: March 1, 1998
View Article titled, Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects
Open the PDF for Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects in another window
Topics: Displacement, Solders, Die cutting, Dimensions, Shearing (Deformation), Thermal energy, Elastic moduli, High temperature, Manufacturing, Relaxation (Physics)
Journal Articles

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 218–227.
https://doi.org/10.1115/1.2792240
Published Online: December 1, 1997
View Article titled, Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
Open the PDF for Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints in another window
Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 233–239.
https://doi.org/10.1115/1.2909323
Published Online: September 1, 1993
View Article titled, Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests
Open the PDF for Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests in another window
Topics: Coating processes, Coatings, Electronic components, Yield stress, Circuits, Die cutting, Flow (Dynamics), Shear stress, Shearing (Deformation)
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 240–248.
https://doi.org/10.1115/1.2909324
Published Online: September 1, 1993
View Article titled, Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter
Open the PDF for Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter in another window
Topics: Coating processes, Coatings, Electronic components, Skin, Yield stress, Die cutting, Disperse systems, Electronic circuits, Flow (Dynamics), Shear stress
Journal Articles

Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam

W.-L. Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 193–198.
https://doi.org/10.1115/1.2906417
Published Online: June 1, 1992
View Article titled, Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam
Open the PDF for Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam in another window
Topics: Die cutting, Polynomials, Shear stress, Shearing (Deformation), Stress, Temperature, Thermal stresses, Variational techniques
Journal Articles

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

P. A. Engel, D. V. Caletka, M. R. Palmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 129–137.
https://doi.org/10.1115/1.2905378
Published Online: June 1, 1991
View Article titled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
Open the PDF for Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems in another window
Topics: Fatigue, Stiffness, Circuits, Stress, Bending (Stress), Computation, Die cutting, Failure, Fatigue strength, Fatigue testing
Journal Articles

Twist-Off Testing of Solder Joint Interconnections

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 165–171.
https://doi.org/10.1115/1.3226529
Published Online: September 1, 1989
View Article titled, Twist-Off Testing of Solder Joint Interconnections
Open the PDF for Twist-Off Testing of Solder Joint Interconnections in another window
Topics: Solder joints, Testing, Shear (Mechanics), Die cutting, Engineers, Quality control, Reliability, Shearing (Deformation), Torque, Vehicles