1-20 of 22
Computation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Integrating Compact Thermal Models in CFD Simulations of Electronic Packages

Rohit Dev Gupta, Vinayak Eswaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021002.
https://doi.org/10.1115/1.2837511
Published Online: April 15, 2008
View Article titled, Integrating Compact Thermal Models in CFD Simulations of Electronic Packages
Open the PDF for Integrating Compact Thermal Models in CFD Simulations of Electronic Packages in another window
Topics: Computational fluid dynamics, Electronic packages, Flow (Dynamics), Junctions, Simulation, Temperature, Heat transfer, Computation, Heat, Boundary-value problems
Journal Articles

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

S. B. Sathe, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
https://doi.org/10.1115/1.1827269
Published Online: January 24, 2005
View Article titled, An Analytical Study of the Optimized Performance of an Impingement Heat Sink
Open the PDF for An Analytical Study of the Optimized Performance of an Impingement Heat Sink in another window
Topics: Design, Flow (Dynamics), Heat sinks, Pressure drop, Computation, Heat transfer, Fins
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging
Open the PDF for Three-Dimensional Paddle Shift Modeling for IC Packaging in another window
Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Article titled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
Open the PDF for Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation in another window
Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 202–208.
https://doi.org/10.1115/1.2792685
Published Online: September 1, 1999
View Article titled, Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
Open the PDF for Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks in another window
Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number
Journal Articles

A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

C. Fu, D. L. McDowell, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 24–34.
https://doi.org/10.1115/1.2792281
Published Online: March 1, 1998
View Article titled, A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects
Open the PDF for A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects in another window
Topics: Copper, Finite element analysis, Solders, Thermomechanics, Constitutive equations, Electronic packaging, Simulation, Algorithms, Computation, Creep
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
Open the PDF for Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints in another window
Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 58–63.
https://doi.org/10.1115/1.2792201
Published Online: March 1, 1997
View Article titled, Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink
Open the PDF for Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink in another window
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
Open the PDF for Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study in another window
Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem

Timothy S. Fisher, F. A. Zell, Kamal K. Sikka, Kenneth E. Torrance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 271–279.
https://doi.org/10.1115/1.2792163
Published Online: December 1, 1996
View Article titled, Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem
Open the PDF for Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem in another window
Topics: Approximation, Heat transfer, Cooling, Thermal resistance, Computation, Finite element analysis, Heat
Journal Articles

Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

D. Mukutmoni, Y. K. Joshi, M. D. Kelleher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 294–300.
https://doi.org/10.1115/1.2792108
Published Online: December 1, 1995
View Article titled, Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity
Open the PDF for Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity in another window
Topics: Computation, Thermal conductivity, Heat, Coolants, Cooling, Electrical measurement, Electronic components, Fluid dynamics, Fluids, Heat sinks
Journal Articles

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

Ann M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 310–316.
https://doi.org/10.1115/1.2905703
Published Online: December 1, 1994
View Article titled, Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
Open the PDF for Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient in another window
Topics: Heat transfer, Heat transfer coefficients, Convection, Heat conduction, Temperature, Radiation (Physics), Computation, Computer cooling, Ducts, Errors
Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Wei Qin, Ira M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 212–219.
https://doi.org/10.1115/1.2905688
Published Online: September 1, 1994
View Article titled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process
Open the PDF for Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process in another window
Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields
Journal Articles

Some Modeling Issues on the Finite Element Computation of Thermal Stresses in Metal Lines

Arturo O. Cifuentes, Iqbal A. Shareef
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 392–403.
https://doi.org/10.1115/1.2909348
Published Online: December 1, 1993
View Article titled, Some Modeling Issues on the Finite Element Computation of Thermal Stresses in Metal Lines
Open the PDF for Some Modeling Issues on the Finite Element Computation of Thermal Stresses in Metal Lines in another window
Topics: Computation, Finite element analysis, Metals, Modeling, Thermal stresses, Manufacturing, Stress, Copper, Plane strain, Reliability
Journal Articles

Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source

Ling Yan, A. Haji-Sheikh, J. V. Beck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 276–283.
https://doi.org/10.1115/1.2909329
Published Online: September 1, 1993
View Article titled, Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source
Open the PDF for Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source in another window
Topics: Heat, Thin films, Temperature, Boundary-value problems, Computation, Diamond films, Heat conduction, Temperature distribution
Journal Articles

Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

D. B. Barker, I. Sharif, A. Dasgupta, M. G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 177–184.
https://doi.org/10.1115/1.2906415
Published Online: June 1, 1992
View Article titled, Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
Open the PDF for Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life in another window
Topics: Fatigue life, Solder joints, Surface mount components, Stiffness, Finite element analysis, Surface mount packaging, Computation, Design, Dimensions, Failure
Journal Articles

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Ching Jen Chen, Ramiro H. Bravo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 294–300.
https://doi.org/10.1115/1.2905409
Published Online: September 1, 1991
View Article titled, Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow
Open the PDF for Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow in another window
Topics: Channel flow, Heat transfer, Heat exchangers, Flow (Dynamics), Separation (Technology), Temperature, Computation, Fluid dynamics, Fluids, Numerical analysis
Journal Articles

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

P. A. Engel, D. V. Caletka, M. R. Palmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 129–137.
https://doi.org/10.1115/1.2905378
Published Online: June 1, 1991
View Article titled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
Open the PDF for Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems in another window
Topics: Fatigue, Stiffness, Circuits, Stress, Bending (Stress), Computation, Die cutting, Failure, Fatigue strength, Fatigue testing
Journal Articles

Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source

Heiu-Jou Shaw, Wen-Lih Chen, Cha’o-Kuang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 40–49.
https://doi.org/10.1115/1.2905365
Published Online: March 1, 1991
View Article titled, Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source
Open the PDF for Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source in another window
Topics: Convection, Heating, Algorithms, Computation, Computer software, Flow (Dynamics), Heat transfer, Reynolds number, Temperature distribution
Journal Articles

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Y. Joshi, D. L. Knight
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 367–374.
https://doi.org/10.1115/1.2904391
Published Online: December 1, 1990
View Article titled, Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water
Open the PDF for Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water in another window
Topics: Heat, Natural convection, Water, Heat transfer, Temperature measurement, Accounting, Computation, Flow visualization, Heating, Temperature