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Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Article titled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
https://doi.org/10.1115/1.4034927
Published Online: October 21, 2016
View Article titled, Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
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Topics: Fillers (Materials), Particulate matter, Cavities, Nanoparticles
Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041012.
Paper No: EP-13-1130
https://doi.org/10.1115/1.4028332
Published Online: September 19, 2014
View Article titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
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Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature
Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031015.
Paper No: EP-13-1050
https://doi.org/10.1115/1.4028013
Published Online: July 24, 2014
View Article titled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature
Journal Articles

Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

Giulio Lorenzini, Cesare Biserni, Emanuel da Silva Diaz Estrada, Elizaldo Domingues Dos Santos, Liércio André Isoldi, Luiz Alberto Oliveira Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031011.
Paper No: EP-14-1022
https://doi.org/10.1115/1.4027421
Published Online: May 12, 2014
View Article titled, Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities
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Topics: Cavities, Degrees of freedom, Design, Genetic algorithms, Optimization, Shapes, Temperature, Simulation, Geometry
Journal Articles

Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study

G. Lorenzini, C. Biserni, L. A. O. Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031007.
Paper No: EP-13-1014
https://doi.org/10.1115/1.4024113
Published Online: June 4, 2013
View Article titled, Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study
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Topics: Cavities, Optimization, Shapes, Thermal resistance
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium

G. Lorenzini, C. Biserni, L. A. Isoldi, E. D. dos Santos, L. A. O. Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
https://doi.org/10.1115/1.4005296
Published Online: December 9, 2011
View Article titled, Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
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Topics: Cavities, Design, Geometry, Optimization, Shapes, Thermal resistance, Degrees of freedom
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
https://doi.org/10.1115/1.2837561
Published Online: February 12, 2008
View Article titled, Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages
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Topics: Cavities, Compression, Flow (Dynamics), Wire, Packaging, Stress, Vehicles, Deformation, Bonding
Journal Articles

Lifetime Estimation of Moems Devices

T. Bar-Kohany, A. Stern
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 144–148.
https://doi.org/10.1115/1.2721085
Published Online: June 13, 2006
View Article titled, Lifetime Estimation of Moems Devices
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Topics: Cavities, Flow (Dynamics), Leakage, Microoptoelectromechanical systems, Pressure, Water, Electrical conductance
Journal Articles

Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half

El Hassan Ridouane, Antonio Campo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 251–258.
https://doi.org/10.1115/1.2229224
Published Online: August 9, 2005
View Article titled, Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half
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Topics: Cavities, Temperature, Convection
Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 475–479.
https://doi.org/10.1115/1.1615796
Published Online: December 15, 2003
View Article titled, A Vapotron Effect Application for Electronic Equipment Cooling
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Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature
Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
https://doi.org/10.1115/1.1569508
Published Online: June 10, 2003
View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number
Journal Articles

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Y. W. Chan, T. H. Ju, Saeed A. Hareb, Y. C. Lee, Jih-Shun Wu, Mirng-Ji Lii
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 246–253.
https://doi.org/10.1115/1.1451844
Published Online: July 26, 2002
View Article titled, Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints
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Topics: Manufacturing, Reliability, Shapes, Solder joints, Solders, Warping, Modeling, Ball-Grid-Array packaging, Fatigue life, Cavities
Journal Articles

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 366–371.
https://doi.org/10.1115/1.1388562
Published Online: February 6, 2001
View Article titled, Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept
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Topics: Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures)
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Article titled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
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Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

J. Lau, T. Chen, S.-W. R. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 242–248.
https://doi.org/10.1115/1.2793847
Published Online: December 1, 1999
View Article titled, Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
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Topics: Ball-Grid-Array packages, Cavities, Flat heat pipes, Ball-Grid-Array packaging, Cooling, Epoxy adhesives, Epoxy resins, Glass, Printed circuit boards, Solders
Journal Articles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 138–146.
https://doi.org/10.1115/1.483146
Published Online: September 21, 1999
View Article titled, Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding
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Topics: Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software
Journal Articles

Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

H. Chai, Y. Zohar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 137–142.
https://doi.org/10.1115/1.2792675
Published Online: September 1, 1999
View Article titled, Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions
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Topics: Steady state, Transfer molding, Wire, Cavities, Density, Failure, Fluid dynamics, Transparency, Vehicles, Vents