Page 1 | Search Results | J. Electron. Packag.

1-8 of 8

Sort by

Sort Order Select

Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska

Publisher: ASME

J. Electron. Packag. September 2021, 143(3): 034501.

Paper No: EP-20-1091

https://doi.org/10.1115/1.4049240

Published Online: January 19, 2021

View Article titled, Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature

Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Chong Ye, Charles I. Ume, Suresh K. Sitaraman

Publisher: ASME

J. Electron. Packag. June 2020, 142(2): 021007.

Paper No: EP-19-1085

https://doi.org/10.1115/1.4046163

Published Online: March 9, 2020

View Article titled, Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties

Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen

Publisher: ASME

J. Electron. Packag. December 2018, 140(4): 041007.

Paper No: EP-18-1041

https://doi.org/10.1115/1.4041014

Published Online: September 10, 2018

View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress

Journal Articles

Electroplated Connections Between Carbon Fiber and Nickel

Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta

Publisher: ASME

J. Electron. Packag. March 2017, 139(1): 011009.

Paper No: EP-16-1045

https://doi.org/10.1115/1.4035703

Published Online: January 27, 2017

View Article titled, Electroplated Connections Between Carbon Fiber and Nickel

Topics: Carbon fibers, Nickel, Metals, Carbon, Solders, Batteries, Electroplating

Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee

Publisher: ASME

J. Electron. Packag. December 2016, 138(4): 041006.

Paper No: EP-16-1095

https://doi.org/10.1115/1.4034842

Published Online: October 10, 2016

View Article titled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel

Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

Publisher: ASME

J. Electron. Packag. December 2014, 136(4): 041011.

Paper No: EP-13-1125

https://doi.org/10.1115/1.4026878

Published Online: September 19, 2014

View Article titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation

Journal Articles

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola

Publisher: ASME

J. Electron. Packag. June 2012, 134(2): 020901.

https://doi.org/10.1115/1.4005909

Published Online: June 11, 2012

View Article titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Topics: Bonding, Carbon nanotubes, Diffusion bonding (Metals), Steady state, Test facilities, Testing, Pressure, Thermal resistance, Nanotubes, Solders

Journal Articles

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne

Publisher: ASME

J. Electron. Packag. June 1998, 120(2): 135–140.

https://doi.org/10.1115/1.2792599

Published Online: June 1, 1998

View Article titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Topics: Carbon, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Journal citation

NARROW

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Electroplated Connections Between Carbon Fiber and Nickel

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only