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Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011004.
Paper No: EP-20-1093
https://doi.org/10.1115/1.4049815
Published Online: August 6, 2021
View Article titled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature
Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
https://doi.org/10.1115/1.4042979
Published Online: April 10, 2019
View Article titled, Reliability Considerations for Oil Immersion-Cooled Data Centers
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Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity
Journal Articles

New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications

N. H. Chao, D. E. Carlucci
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021003.
Paper No: EP-18-1047
https://doi.org/10.1115/1.4042471
Published Online: March 1, 2019
View Article titled, New Electronic Packaging Method for Potted Guidance Electronics to Sustain Temperature Cycling and Survive High-G Applications
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Topics: Electronics, Temperature, Simulation, Capacitors
Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
https://doi.org/10.1115/1.4039790
Published Online: May 10, 2018
View Article titled, Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
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Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Article titled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
Open the PDF for Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric in another window
Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
View Article titled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
Open the PDF for Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading in another window
Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

On-Wafer Capacitors Under Mechanical Stress

Päivi H. Karjalainen, Pekka Heino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
https://doi.org/10.1115/1.2753918
Published Online: August 24, 2006
View Article titled, On-Wafer Capacitors Under Mechanical Stress
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Topics: Capacitors, Semiconductor wafers, Stress, Complementary metal oxide semiconductors
Journal Articles

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

S. Chaparala, J. M. Pitarresi, S. Parupalli, S. Mandepudi, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
https://doi.org/10.1115/1.2353280
Published Online: February 23, 2006
View Article titled, Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
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Topics: Ball-Grid-Array packaging, Manufacturing, Reliability, Stiffness, Mirrors, Cycles, Solder joints, Solders, Finite element analysis, Capacitors
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Article titled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Swapan K. Bhattacharya, Faculty of Research, Rao R. Tummala, Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
https://doi.org/10.1115/1.1400751
Published Online: January 12, 2001
View Article titled, Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives
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Topics: Capacitors, Epoxy adhesives, Epoxy resins, Manufacturing, Nanocomposites, Composite materials, Ceramics, Polymers, Fillers (Materials), Particulate matter
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Article titled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

A New Method to Determine Crack Shape and Size in Solder Joints

T. Reinikainen, F. W. Wulff, W. Kolbe, T. Ahrens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 266–269.
https://doi.org/10.1115/1.2792103
Published Online: December 1, 1995
View Article titled, A New Method to Determine Crack Shape and Size in Solder Joints
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Topics: Fracture (Materials), Shapes, Solder joints, Solders, Computer-aided design, Fatigue cracks, Capacitors, Ceramics, Copper, Image processing
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Article titled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
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Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors

M. K. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 147–153.
https://doi.org/10.1115/1.2904355
Published Online: June 1, 1990
View Article titled, Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors
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Topics: Capacitors, Solder joints, Stress, Design, Rotation, Solders, Ceramics, Manufacturing, Printed circuit boards
Journal Articles

Modeling Thermal Stress Behavior in Microelectronic Components

G. C. Scott, G. Astfalk
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 35–40.
https://doi.org/10.1115/1.2904338
Published Online: March 1, 1990
View Article titled, Modeling Thermal Stress Behavior in Microelectronic Components
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Topics: Modeling, Thermal stresses, Stress, Failure, Mechanical properties, Thermal stress cracking, Capacitors, Ceramics, Cracking (Materials), Dimensions
Journal Articles

Solder Fillet Height Criteria for Surface Mounted Chip Components

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 299–302.
https://doi.org/10.1115/1.3226551
Published Online: December 1, 1989
View Article titled, Solder Fillet Height Criteria for Surface Mounted Chip Components
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Topics: Solders, Capacitors, Ceramics, Solder joints, Thermal shock, Cycles, Fracture (Materials), Lumber, Navy, Tantalum