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Journal Articles

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

David J. Lettieri, Michael M. Toulouse, Cullen E. Bash, Amip J. Shah, Van P. Carey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030903.
Paper No: EP-12-1090
https://doi.org/10.1115/1.4024302
Published Online: July 24, 2013
View Article titled, Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers
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Topics: Buoyancy, Computational fluid dynamics, Data centers, Flow (Dynamics), Temperature, Vortices, Server racks, Approximation
Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
https://doi.org/10.1115/1.2229225
Published Online: September 23, 2005
View Article titled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
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Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials
Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
https://doi.org/10.1115/1.1569508
Published Online: June 10, 2003
View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number
Journal Articles

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

A. Gupta, Y. Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 243–252.
https://doi.org/10.1115/1.2792629
Published Online: September 1, 1998
View Article titled, Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct
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Topics: Cooling, Ducts, Heat, Reynolds number, Heat transfer, Water, Algebra, Buoyancy, Flow (Dynamics), Flow visualization
Journal Articles

Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

D. Yu, T. A. Ameel, R. O. Warrington, R. F. Barron
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 275–280.
https://doi.org/10.1115/1.2792249
Published Online: December 1, 1997
View Article titled, Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters
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Topics: Buoyancy, Heat transfer, Integrated circuits, Mixed convection, Flow (Dynamics), Temperature, Thermal conductivity, Forced convection, Convection, Electronics
Journal Articles

Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection

Y. S. Son, T. L. Bergman, M. T. Hyun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 317–322.
https://doi.org/10.1115/1.2792111
Published Online: December 1, 1995
View Article titled, Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
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Topics: Heat transfer, Nitrogen, Ovens, Reflow soldering, Simulation, Buoyancy, Computer simulation, Cooling, Fluctuations (Physics), Heating
Journal Articles

Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection

T. J. Heindel, F. P. Incropera, S. Ramadhyani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 55–62.
https://doi.org/10.1115/1.2905442
Published Online: March 1, 1992
View Article titled, Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection
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Topics: Convection, Cooling, Heat, Flow (Dynamics), Heat transfer, Reynolds number, Buoyancy, Forced convection, Turbulence, Fluids
Journal Articles

Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms

N. J. Fernandes, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 41–47.
https://doi.org/10.1115/1.2905440
Published Online: March 1, 1992
View Article titled, Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms
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Topics: Heat transfer, Reflow soldering, Temperature effects, Ovens, Buoyancy, Computer simulation, Convection, Forced convection, Heating, Transients (Dynamics)
Journal Articles

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Y. Chin, C. F. Ma, X. Q. Gu, L. Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 309–312.
https://doi.org/10.1115/1.2905411
Published Online: September 1, 1991
View Article titled, Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel
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Topics: Convection, Flow (Dynamics), Integrated circuits, Heat transfer, Buoyancy, Forced convection, Mixed convection, Rayleigh number, Reynolds number
Journal Articles

The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity

A. Khalillolahi, B. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 357–366.
https://doi.org/10.1115/1.2904390
Published Online: December 1, 1990
View Article titled, The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity
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Topics: Cavities, Heat capacity, Natural convection, Specific heat, Transients (Dynamics), Flow (Dynamics), Heat conduction, Buoyancy, Convection, Fluids
Journal Articles

Buoyancy-Induced Flows and Transport

Benjamin Gebhart, Author, Yogesh Jaluria, Author, Roop L. Mahajan, Author, Bahgat Sammakia, Author, M. M. Yovanovich, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 1989, 111(4): 321.
https://doi.org/10.1115/1.3226555
Published Online: December 1, 1989
View Article titled, Buoyancy-Induced Flows and Transport
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Topics: Buoyancy, Flow (Dynamics)
Journal Articles

Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards

C. Rajakumar, D. Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 129–134.
https://doi.org/10.1115/1.3226517
Published Online: June 1, 1989
View Article titled, Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards
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Topics: Finite element analysis, Heat transfer coefficients, Natural convection, Printed circuit boards, Flow (Dynamics), Computation, Convection, Heating, Strips, Buoyancy