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Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031121.
Paper No: EP-20-1008
https://doi.org/10.1115/1.4047844
Published Online: August 7, 2020
View Article titled, Flexure and Twist Test Reliability Assurance of Flexible Electronics
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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing
Journal Articles

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

Mikio Muraoka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
https://doi.org/10.1115/1.1324674
Published Online: June 28, 2000
View Article titled, The Maximum Stress in Optical Glass Fibers Under Two-Point Bending
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Topics: Bending (Stress), Fibers, Optical glass, Stress, Stress-strain relations, Optical fiber
Journal Articles

How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1995, 117(1): 88–92.
https://doi.org/10.1115/1.2792073
Published Online: March 1, 1995
View Article titled, How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
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Topics: Adhesives, Bending (Stress), Diluents, Elastic constants, Epoxy adhesives, Manufacturing, Mechanical behavior, Rails, Silicones, Stiffness
Journal Articles

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

P. A. Engel, D. V. Caletka, M. R. Palmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 129–137.
https://doi.org/10.1115/1.2905378
Published Online: June 1, 1991
View Article titled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
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Topics: Fatigue, Stiffness, Circuits, Stress, Bending (Stress), Computation, Die cutting, Failure, Fatigue strength, Fatigue testing