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Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
https://doi.org/10.1115/1.4065939
Published Online: August 9, 2024
View Article titled, Electrically Conductive Adhesives in Microelectronics Packaging
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Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter
Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Soumya Bandyopadhyay, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021009.
Paper No: EP-22-1047
https://doi.org/10.1115/1.4055987
Published Online: November 1, 2022
View Article titled, A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
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Topics: Heat, Transients (Dynamics), Temperature, Anisotropy
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Article titled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
https://doi.org/10.1115/1.4039020
Published Online: March 2, 2018
View Article titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy
Journal Articles

Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect

X. C. Chen, Bo Tao, Z. P. Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031007.
https://doi.org/10.1115/1.4006889
Published Online: July 18, 2012
View Article titled, Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
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Topics: Deformation, Finite element analysis, Particulate matter, Bonding, Adhesives, Anisotropy
Journal Articles

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

Yasutada Nakagawa, Ryohei Yokoyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011005.
https://doi.org/10.1115/1.4005954
Published Online: March 19, 2012
View Article titled, Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection
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Topics: Hardening (Curing), Heating, Optimization, Temperature, Viscosity, Anisotropy
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Article titled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
https://doi.org/10.1115/1.3103947
Published Online: April 2, 2009
View Article titled, High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules
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Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields
Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
https://doi.org/10.1115/1.1849236
Published Online: June 3, 2005
View Article titled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
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Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
https://doi.org/10.1115/1.1846066
Published Online: March 21, 2005
View Article titled, Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
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Topics: Adhesion, Adhesives, Anisotropy, Testing, Fracture toughness, Reliability, Pressure
Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 375–380.
https://doi.org/10.1115/1.2056570
Published Online: February 14, 2005
View Article titled, Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
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Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion
Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
https://doi.org/10.1115/1.1604153
Published Online: December 15, 2003
View Article titled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
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Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis
Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 76–83.
https://doi.org/10.1115/1.1533060
Published Online: March 14, 2003
View Article titled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
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Topics: Computer software, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Thermal conductivity, Errors, Computational fluid dynamics
Journal Articles

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel, R. Ku¨hnert, M. Dost, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
https://doi.org/10.1115/1.1506698
Published Online: December 12, 2002
View Article titled, Determination of Packaging Material Properties Utilizing Image Correlation Techniques
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Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress
Journal Articles

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Weidong Xie, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 61–66.
https://doi.org/10.1115/1.483133
Published Online: December 12, 1999
View Article titled, Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures
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Topics: Laminates, Stress, Thermal stresses, Shapes, Anisotropy, Electronic packaging
Journal Articles

Thermal Management in Direct Chip Attach Assemblies

D. F. Baldwin, J. T. Beerensson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 222–230.
https://doi.org/10.1115/1.2793844
Published Online: December 1, 1999
View Article titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions