Topics: Cylinders , Interferometers , Interferometry , Temperature , Flow (Dynamics) , Cooling , Thermal conductivity , Natural convection , Computer cooling

Solid-State Microrefrigeration in Conjunction With Liquid Cooling

Younes Ezzahri, Ali Shakouri

J. Electron. Packag. September 2010, 132(3): 031002. doi: https://doi.org/10.1115/1.4001853

Abstract

View articletitled, Solid-State Microrefrigeration in Conjunction With Liquid Cooling

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Topics: Cooling , Temperature , Thermoelectric coolers , Thin films

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno

J. Electron. Packag. September 2010, 132(3): 031003. doi: https://doi.org/10.1115/1.4001854

Abstract

View articletitled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

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Topics: Hardening (Curing) , Particulate matter , Resins , Ultraviolet radiation , Glass , Holography , Temperature , Displacement , Microchannels

How to Estimate Heat Spreading Effects in Practice

Clemens J. M. Lasance

J. Electron. Packag. September 2010, 132(3): 031004. doi: https://doi.org/10.1115/1.4001856

Abstract

View articletitled, How to Estimate Heat Spreading Effects in Practice

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Topics: Heat , Thermal resistance , Thermal conductivity , Temperature

Study on a Pulsating Heat Pipe With Self-Rewetting Fluid

Koji Fumoto, Masahiro Kawaji, Tsuyoshi Kawanami

J. Electron. Packag. September 2010, 132(3): 031005. doi: https://doi.org/10.1115/1.4001855

Abstract

View articletitled, Study on a Pulsating Heat Pipe With Self-Rewetting Fluid

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Topics: Fluids , Heat pipes , Temperature , Water , Surface tension , Heat transfer , Thermal resistance , Heat

Coordinated Optimization of Cooling and IT Power in Data Centers

Emad Samadiani, Hrishikesh Amur, Bhavani Krishnan, Yogendra Joshi, Karsten Schwan

J. Electron. Packag. September 2010, 132(3): 031006. doi: https://doi.org/10.1115/1.4001858

Abstract

View articletitled, Coordinated Optimization of Cooling and IT Power in Data Centers

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Topics: Cooling , Data centers , Design , Optimization , Modeling , Energy consumption

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Varghese Panthalookaran

J. Electron. Packag. September 2010, 132(3): 031007. doi: https://doi.org/10.1115/1.4002009

Abstract

View articletitled, CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

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Topics: Computational fluid dynamics , Cooling , Energy dissipation , Flow (Dynamics) , Heat , Temperature , Natural convection , MOSFET transistors , Separation (Technology) , Optimization

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen

J. Electron. Packag. September 2010, 132(3): 031008. doi: https://doi.org/10.1115/1.4002010

Abstract

View articletitled, Interactions Between Flip Chip Underfill and Solder Alloy

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Topics: Alloys , Flip-chip , Flip-chip devices , Solders , Thermal shock , Thermal expansion , Testing , Adhesion , Reliability , Cycles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu

J. Electron. Packag. September 2010, 132(3): 031009. doi: https://doi.org/10.1115/1.4002012

Abstract

View articletitled, Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

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Topics: Cooling , Design , Energy dissipation , Heat , Liquid metals , Pumps , Thermal resistance , Water , Flow (Dynamics) , Engineering prototypes

Phosphor Concentration Effects on Optothermal Characteristics of Phosphor Converted White Light-Emitting Diodes

Jiun Pyng You, Yeong-Her Lin, Nguyen T. Tran, Frank G. Shi

J. Electron. Packag. September 2010, 132(3): 031010. doi: https://doi.org/10.1115/1.4002298

Abstract

View articletitled, Phosphor Concentration Effects on Optothermal Characteristics of Phosphor Converted White Light-Emitting Diodes

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Topics: Junctions , Light-emitting diodes , Phosphors , Temperature

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Xin Li, Xu Chen, Guo-Quan Lu

J. Electron. Packag. September 2010, 132(3): 031011. doi: https://doi.org/10.1115/1.4002299

Abstract

View articletitled, Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

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Topics: Bonding , Epoxy adhesives , Epoxy resins , Light-emitting diodes , Packaging , Reliability , Silver , Temperature , Tin , Heat

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori

J. Electron. Packag. September 2010, 132(3): 031012. doi: https://doi.org/10.1115/1.4002451

Abstract

View articletitled, Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

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Topics: Bonding , Crack propagation , Fatigue life , Fracture (Materials) , Reliability , Solder joints , Temperature , Temperature distribution , Wire , Wire bonding