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Issues
December 2009
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Measurement of Leak Rate for MEMS Vacuum Packaging
J. Electron. Packag. December 2009, 131(4): 041001.
doi: https://doi.org/10.1115/1.3144148
Topics:
Leakage
,
Packaging
,
Vacuum
,
Pressure
,
Flow (Dynamics)
A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks
J. Electron. Packag. December 2009, 131(4): 041002.
doi: https://doi.org/10.1115/1.4000207
Topics:
Design
,
Flip-chip
,
Lenses (Optics)
,
Optical fiber
The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface
J. Electron. Packag. December 2009, 131(4): 041003.
doi: https://doi.org/10.1115/1.4000209
Topics:
Fracture (Materials)
,
Shear (Mechanics)
,
Modeling
,
Fracture mechanics
The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps
J. Electron. Packag. December 2009, 131(4): 041004.
doi: https://doi.org/10.1115/1.4000206
Topics:
Intermetallic compounds
,
Solders
,
Temperature
,
Tin
,
Semiconductor wafers
,
Failure mechanisms
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
J. Electron. Packag. December 2009, 131(4): 041005.
doi: https://doi.org/10.1115/1.4000211
Topics:
Design
,
Physics
,
Atomic clocks
,
Temperature
,
Thermal resistance
,
Shock (Mechanics)
,
Finite element analysis
,
Structural analysis
Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
J. Electron. Packag. December 2009, 131(4): 041006.
doi: https://doi.org/10.1115/1.4000210
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
J. Electron. Packag. December 2009, 131(4): 041007.
doi: https://doi.org/10.1115/1.4000281
Topics:
Bonding
,
Displacement
,
Elastic moduli
,
Finite element analysis
,
Modeling
,
Sensitivity analysis
,
Simulation
,
Stress
,
Finite element model
Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. December 2009, 131(4): 041008.
doi: https://doi.org/10.1115/1.4000361
Topics:
Bonding
,
Warping
,
Glass
,
Temperature
Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
J. Electron. Packag. December 2009, 131(4): 041009.
doi: https://doi.org/10.1115/1.4000363
Topics:
Adhesives
,
Complementary metal oxide semiconductors
,
Energy dissipation
,
Glass
,
Packaging
,
Sensors
,
Taguchi methods
,
Temperature
,
Bonding
,
Heat
A Novel Ceramic Packaging Technique Using Selective Induction Heating
J. Electron. Packag. December 2009, 131(4): 041010.
doi: https://doi.org/10.1115/1.4000366
Topics:
Ceramics
,
Electromagnetic induction
,
Heating
,
Packaging
,
Temperature
Technical Briefs
Novel Design of Thermal-Via Configurations for Collector-Up HBTs
J. Electron. Packag. December 2009, 131(4): 044501.
doi: https://doi.org/10.1115/1.4000282
Topics:
Design
,
Finite element model
,
Gallium arsenide
,
Temperature
,
Temperature distribution
,
Transistors
,
Finite element analysis
,
Packaging
,
Heat
Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
J. Electron. Packag. December 2009, 131(4): 044502.
doi: https://doi.org/10.1115/1.4000208
Topics:
Geometry
,
Solder joints
,
Solders
,
Failure
,
Fatigue
,
Alloys
,
Energy dissipation
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Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)